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1. (WO2018163982) MULTILAYERED SUBSTRATE
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Pub. No.: WO/2018/163982 International Application No.: PCT/JP2018/007945
Publication Date: 13.09.2018 International Filing Date: 02.03.2018
IPC:
H05K 3/46 (2006.01) ,H05K 1/03 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
花尾 昌昭 HANAO, Masaaki; JP
勝部 毅 KATSUBE, Tsuyoshi; JP
Agent:
特許業務法人 安富国際特許事務所 YASUTOMI & ASSOCIATES; 大阪府大阪市淀川区宮原3丁目5番36号 5-36, Miyahara 3-chome, Yodogawa-ku, Osaka-shi, Osaka 5320003, JP
Priority Data:
2017-04501209.03.2017JP
Title (EN) MULTILAYERED SUBSTRATE
(FR) SUBSTRAT MULTICOUCHE
(JA) 多層基板
Abstract:
(EN) This multilayer substrate includes ceramic layers and a resin layer, wherein the multilayer substrate is characterized in that: the ceramic layers include a first ceramic layer, which is a dense body, and a second ceramic layer, which has open pores; the second ceramic layer is adjacent to the resin layer; and the material constituting the resin layer is diffused into the second ceramic layer.
(FR) L'invention concerne un substrat multicouche qui comprend des couches de céramique et une couche de résine, le substrat multicouche étant caractérisé en ce que : les couches de céramique comprennent une première couche de céramique, qui est un corps dense, et une seconde couche de céramique, qui possède des pores ouverts ; la seconde couche de céramique est adjacente à la couche de résine ; et le matériau constituant la couche de résine est diffusé dans la seconde couche de céramique.
(JA) 本発明の多層基板は、セラミック層と樹脂層とを含む多層基板であって、上記セラミック層は、緻密体である第1のセラミック層と、開気孔を有する第2のセラミック層とを含み、上記第2のセラミック層は、上記樹脂層と隣接しており、上記樹脂層の材料が上記第2のセラミック層に拡散していることを特徴とする。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)