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1. (WO2018163935) WAFER SUPPORT BASE

Pub. No.:    WO/2018/163935    International Application No.:    PCT/JP2018/007542
Publication Date: Fri Sep 14 01:59:59 CEST 2018 International Filing Date: Thu Mar 01 00:59:59 CET 2018
IPC: H01L 21/683
H01L 21/3065
H01L 21/31
Applicants: NGK INSULATORS, LTD.
日本碍子株式会社
Inventors: TAKAHASHI, Tomohiro
高橋 朋大
Title: WAFER SUPPORT BASE
Abstract:
A wafer support base 20 comprises a disc-shaped ceramic substrate 22 having a wafer mounting surface 22a, and includes an RF electrode 23 and a heater electrode 30 which are embedded in that order in the ceramic substrate 22 from the wafer mounting surface 22a side. The RF electrode 23 is configured from a plurality of RF zone electrodes 24, 25 formed in zones on the same plane. The plurality of RF zone electrodes 24, 25 and the heater electrode 30 are respectively independently connected to a plurality of RF zone electrode conductors 34, 35 and wiring members 38, 38 which are provided outside a back surface 22b of the ceramic substrate 22.