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1. (WO2018163864) SUBSTRATE FOR POWER MODULE HAVING HEAT SINK

Pub. No.:    WO/2018/163864    International Application No.:    PCT/JP2018/006745
Publication Date: Fri Sep 14 01:59:59 CEST 2018 International Filing Date: Sat Feb 24 00:59:59 CET 2018
IPC: H01L 23/36
H01L 23/12
H01L 23/13
H01L 23/373
H05K 1/02
Applicants: MITSUBISHI MATERIALS CORPORATION
三菱マテリアル株式会社
Inventors: YUMOTO, Ryohei
湯本 遼平
OI, Sotaro
大井 宗太郎
Title: SUBSTRATE FOR POWER MODULE HAVING HEAT SINK
Abstract:
The present invention is provided with: a substrate for a power module, which is constructed by disposing a metal layer and a circuit layer comprising copper or the like on both surfaces of a ceramic substrate; an aluminum layer; a copper layer; and a heat sink comprising an aluminum-impregnated silicon carbide porous body, wherein diffusion layers having an intermetallic compound of aluminum and copper are formed between the metal layer and the aluminum layer, between the aluminum layer and the copper layer, and between the copper layer and the aluminum-impregnated silicon carbide porous body, also wherein the circuit layer has a thickness t1 of 0.1-3.0 mm, the metal layer has a thickness t2 of 0.1-3.0 mm, a thickness t3 is 3.0 mm or less, a thickness t4 is between 0.1 mm and 5.0 mm, and the ratio [(σ1×t1×A1)/{(σ2×t2×A2)+(σ3×t3×A3)+(σ4×t4×A4)}] falls within the range of 0.06-0.70.