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1. (WO2018163796) TERMINAL DEVICE FOR ELECTRIC EQUIPMENT AND METHOD FOR MANUFACTURING TERMINAL DEVICE FOR ELECTRIC EQUIPMENT
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Pub. No.: WO/2018/163796 International Application No.: PCT/JP2018/005878
Publication Date: 13.09.2018 International Filing Date: 20.02.2018
Chapter 2 Demand Filed: 04.07.2018
IPC:
H01R 13/52 (2006.01) ,F16J 15/14 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
46
Bases; Cases
52
Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16
ENGINEERING ELEMENTS OR UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
J
PISTONS; CYLINDERS; PRESSURE VESSELS IN GENERAL; SEALINGS
15
Sealings
02
between relatively-stationary surfaces
14
by means of granular or plastic material, or fluid
Applicants:
株式会社オートネットワーク技術研究所 AUTONETWORKS TECHNOLOGIES, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電装株式会社 SUMITOMO WIRING SYSTEMS, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区北浜四丁目5番33号 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
Inventors:
金 知聖 KIM, Jisung; JP
中嶋 一雄 NAKASHIMA, Kazuo; JP
廣瀬 満 HIROSE, Mitsuru; JP
Agent:
恩田 誠 ONDA, Makoto; JP
恩田 博宣 ONDA, Hironori; JP
Priority Data:
2017-04305307.03.2017JP
Title (EN) TERMINAL DEVICE FOR ELECTRIC EQUIPMENT AND METHOD FOR MANUFACTURING TERMINAL DEVICE FOR ELECTRIC EQUIPMENT
(FR) DISPOSITIF BORNE DESTINÉ À UN ÉQUIPEMENT ÉLECTRIQUE ET PROCÉDÉ DE FABRICATION DE DISPOSITIF BORNE DESTINÉ À UN ÉQUIPEMENT ÉLECTRIQUE
(JA) 電気機器用端末装置及び電気機器用端末装置の製造方法
Abstract:
(EN) This terminal device 100 for electric equipment is provided with: a housing 11 having a fitting part 12 that can be fitted into a mating member; a receiving groove 14 that is disposed on an end surface 11a of the housing 11 and provided around the fitting part 12, the end surface 11a facing the mating member; and an annular seal member 13 provided in the receiving groove 14, and sealing the space between the end surface 11a of the housing 11 and the mating member in a watertight manner. As the seal member 13, a liquid gasket is filled in the receiving groove 14.
(FR) L'invention concerne un dispositif borne (100) destiné à un équipement électrique et comprenant : un boîtier (11) ayant une partie d'ajustement (12) qui peut être ajustée dans un élément apparié ; une rainure de réception (14) qui est située sur une surface d'extrémité (11a) du boîtier (11) et est prévue autour de la partie d'ajustement (12), la surface d'extrémité (11a) faisant face à l'élément apparié ; et un élément d'étanchéité annulaire (13) prévu dans la rainure de réception (14), et étanchéifiant de manière étanche à l'eau l'espace entre la surface d'extrémité (11a) du boîtier (11) et l'élément apparié. En tant qu'élément d'étanchéité (13), un joint d'étanchéité liquide remplit la rainure de réception (14).
(JA) 電気機器用端末装置100は、相手部材に嵌合可能な嵌合部12を有するハウジング11と、ハウジング11の相手部材側を向く端面11a上であって、嵌合部12の周囲に設けられた収容溝14と、収容溝14内に設けられ、ハウジング11の端面11aと相手部材との間を水密にシールする環状のシール部材13とを備え、シール部材13として、収容溝14に液状ガスケットを充填した。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)