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1. (WO2018163755) POSITIONING MECHANISM FOR KELVIN INSPECTION TERMINAL AND IC SOCKET PROVIDED WITH SAME
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Pub. No.: WO/2018/163755 International Application No.: PCT/JP2018/005385
Publication Date: 13.09.2018 International Filing Date: 16.02.2018
IPC:
G01R 31/26 (2014.01) ,G01R 1/067 (2006.01) ,G01R 1/073 (2006.01) ,H01R 33/76 (2006.01)
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26
Testing of individual semiconductor devices
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
06
Measuring leads; Measuring probes
067
Measuring probes
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
06
Measuring leads; Measuring probes
067
Measuring probes
073
Multiple probes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
33
Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
74
Devices having four or more poles
76
Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
Applicants:
山一電機株式会社 YAMAICHI ELECTRONICS CO., LTD. [JP/JP]; 東京都大田区南蒲田2-16-2 2-16-2, Minamikamata, Ota-ku Tokyo 1448581, JP
Inventors:
鈴木 勝己 SUZUKI Katsumi; JP
齋藤 朋徳 SAITO Tomonori; JP
Priority Data:
2017-04665210.03.2017JP
Title (EN) POSITIONING MECHANISM FOR KELVIN INSPECTION TERMINAL AND IC SOCKET PROVIDED WITH SAME
(FR) MÉCANISME DE POSITIONNEMENT DESTINÉ À UNE BORNE D'INSPECTION KELVIN ET SUPPORT DE CIRCUIT INTÉGRÉ ÉQUIPÉE DE CE DERNIER
(JA) ケルビン検査用端子の位置決め機構、および、それを備えるICソケット
Abstract:
(EN) This positioning mechanism for a Kelvin inspection terminal makes it possible to simply assemble a Kelvin inspection terminal together with an IC socket and enhance the accuracy of the positioning of the Kelvin inspection terminal in relation to semiconductor device electrode parts. A mounting base 20 for an object of inspection has a plurality of holes 20ai into which electrode parts DVa of a semiconductor device DV are inserted and by which the electrode parts DVa are positioned. The bottom parts of the holes 20ai have, formed in two locations, through holes 20d into which device plungers 12 for each probe 10 are inserted.
(FR) Selon la présente invention, ce mécanisme de positionnement destiné à une borne d'inspection Kelvin permet d'assembler simplement une borne d'inspection Kelvin avec un support de circuit intégré et d'améliorer la précision du positionnement de la borne d'inspection Kelvin par rapport aux parties d'électrode de dispositif semi-conducteur. Une base de montage (20) destinée à un objet d'inspection a une pluralité de trous (20a) dans lesquels des parties d'électrode (DVa) d'un dispositif semi-conducteur (DV) sont insérées et par lesquelles les parties d'électrode (DVa) sont positionnées. Les parties inférieures des trous (20ai) présentent, sur deux emplacements, des trous traversants (20d) dans lesquels des plongeurs de dispositif (12) destinés à chaque sonde (10) sont insérés.
(JA) ケルビン検査用端子の位置決め機構において、ケルビン検査用端子をICソケットに簡単に組み付けることができ、しかも、ケルビン検査用端子の半導体装置の電極部に対する位置決め精度を向上させることができる。被検査物搭載台20は、半導体装置DVの各電極部DVaが挿入され位置決めされる複数の孔20aiを有し、孔20aiの底部には、各プローブ10のデバイス用プランジャー12が挿入される貫通孔20dが2箇所に形成されているもの。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)