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1. (WO2018163721) CARRIER FOR DOUBLE-SIDED POLISHING DEVICE
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Pub. No.: WO/2018/163721 International Application No.: PCT/JP2018/004856
Publication Date: 13.09.2018 International Filing Date: 13.02.2018
IPC:
B24B 37/28 (2012.01) ,H01L 21/304 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
27
Work carriers
28
for double side lapping of plane surfaces
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
信越半導体株式会社 SHIN-ETSU HANDOTAI CO.,LTD. [JP/JP]; 東京都千代田区大手町二丁目2番1号 2-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo 1000004, JP
Inventors:
北爪 大地 KITAZUME Daichi; JP
田中 佑宜 TANAKA Yuki; JP
Agent:
好宮 幹夫 YOSHIMIYA Mikio; JP
小林 俊弘 KOBAYASHI Toshihiro; JP
Priority Data:
2017-04174006.03.2017JP
2017-15690815.08.2017JP
Title (EN) CARRIER FOR DOUBLE-SIDED POLISHING DEVICE
(FR) SUPPORT DESTINÉ À UN DISPOSITIF DE POLISSAGE DOUBLE FACE
(JA) 両面研磨装置用キャリア
Abstract:
(EN) The present invention relates to a carrier for a double-sided polishing device, the carrier having: a carrier base material in which a holding hole for holding a wafer during polishing is formed; and an insert material disposed along the inner circumference of the holding hole. In the carrier base material, an uneven part is periodically formed along the inner circumference of the holding hole, the distance between the centers of recess portions adjacent to each other in the uneven part is 10 mm to 60 mm, and the area of a protruding portion of the uneven part is larger than the area of a notch portion of the recess part. In the insert material, an uneven part, which can be fitted with the uneven part formed on the inner circumference of the holding hole, is periodically formed on the outer circumference of the insert material, and the uneven part formed on the inner circumference of the holding hole of the carrier base material is fitted with the uneven part formed on the outer circumference of the insert material. Thus, the carrier for the double-sided polishing device, in which deformation of a peripheral portion (fitting portion) of the holding hole in the carrier base material is reduced, is provided.
(FR) La présente invention concerne un support destiné à un dispositif de polissage double face, le support ayant : un matériau de base de support dans lequel est formé un trou de maintien destiné à maintenir une tranche pendant le polissage; et un matériau d'insert disposé le long de la circonférence interne du trou de maintien. Dans le matériau de base de support, une partie irrégulière est formée périodiquement le long de la circonférence interne du trou de maintien, la distance entre les centres de parties évidements adjacentes les unes aux autres dans la partie irrégulière va de 10 mm à 60 mm, et la zone d'une partie saillante de la partie irrégulière est plus grande que la zone d'une partie encoche de la partie évidement. Dans le matériau d'insert, une partie irrégulière, qui peut être munie de la partie irrégulière formée sur la circonférence interne du trou de maintien, est formée périodiquement sur la circonférence externe du matériau d'insert, et la partie irrégulière formée sur la circonférence interne du trou de maintien du matériau de base de support est munie de la partie irrégulière formée sur la circonférence externe du matériau d'insert. Ainsi, l’invention concerne le support destiné au dispositif de polissage double face, dans lequel une déformation d'une partie périphérique (partie de monture) du trou de maintien dans le matériau de base de support est réduite.
(JA) 本発明は、研磨の際にウェーハを保持するための保持孔が形成されたキャリア母材と、保持孔の内周に沿って配置されたインサート材とを有する両面研磨装置用キャリアであって、キャリア母材は、保持孔の内周に沿って凹凸部が周期的に形成されたものであり、凹凸部における隣接する凹部の中心同士の距離が10mm以上60mm以下であり、凹凸部における凸部の面積が凹部の切り欠き部分の面積よりも大きいものであり、インサート材は、保持孔の内周に形成された凹凸部と嵌合可能である凹凸部が外周部に周期的に形成されたものであり、キャリア母材の保持孔の内周に形成された凹凸部と、インサート材の外周部に形成された凹凸部とが嵌合したものであることを特徴とする両面研磨装置用キャリアである。これにより、キャリア母材の保持孔周辺部分(嵌合部分)の歪みが低減された両面研磨装置用キャリアが提供される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)