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1. (WO2018163338) METHOD FOR MANUFACTURING ORGANIC EL DEVICE AND APPARATUS FOR FORMING FILM
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Pub. No.: WO/2018/163338 International Application No.: PCT/JP2017/009334
Publication Date: 13.09.2018 International Filing Date: 08.03.2017
IPC:
H05B 33/10 (2006.01) ,B05C 9/12 (2006.01) ,B05D 3/06 (2006.01) ,G09F 9/30 (2006.01) ,H01L 27/32 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/02 (2006.01) ,H05B 33/04 (2006.01) ,H05B 33/06 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
9
Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups B05C1/-B05C7/159
08
for applying liquid or other fluent material and performing an auxiliary operation
12
the auxiliary operation being performed after the application
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3
Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
06
by exposure to radiation
G PHYSICS
09
EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
F
DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9
Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30
in which the desired character or characters are formed by combining individual elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28
including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32
with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
04
Sealing arrangements
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
06
Electrode terminals
Applicants:
堺ディスプレイプロダクト株式会社 SAKAI DISPLAY PRODUCTS CORPORATION [JP/JP]; 大阪府堺市堺区匠町１番地 1, Takumicho, Sakai-ku, Sakai-shi, Osaka 5908522, JP
Inventors:
岸本　克彦 KISHIMOTO, Katsuhiko; --
Agent:
奥田　誠司 OKUDA Seiji; JP
Priority Data:
Title (EN) METHOD FOR MANUFACTURING ORGANIC EL DEVICE AND APPARATUS FOR FORMING FILM
(FR) PROCÉDÉ DE FABRICATION D'UN DISPOSITIF EL ORGANIQUE ET APPAREIL DE FORMATION DE FILM
(JA) 有機ＥＬデバイスの製造方法および成膜装置
Abstract:
(EN) A method for manufacturing an organic EL device according to the present disclosure comprises: a step of preparing an element substrate which is provided with a substrate and a plurality of organic EL devices arranged on the substrate; and a step of forming a thin-film sealing structure on the element substrate. The step of forming a thin film sealing structure comprises: a step of forming a first inorganic barrier layer on the element substrate; a step of condensing a photocurable resin on the first inorganic barrier layer; a step of irradiating, with a laser beam, a plurality of selected areas of the photocurable resin, and curing at least a portion of the photocurable resin to form a photocured resin layer; a step of removing a non-cured portion of the photocurable resin; and a step of forming, on the first inorganic barrier layer, a second inorganic barrier layer which covers the photocured resin layer.
(FR) La présente invention concerne un procédé de fabrication d'un dispositif EL organique qui comprend : une étape de préparation d'un substrat d'élément qui est pourvu d'un substrat et d'une pluralité de dispositifs EL organiques placés sur le substrat ; et une étape de formation d'une structure d'étanchéité à film mince sur le substrat d'élément. L'étape de formation d'une structure d'étanchéité à film mince comprend : une étape de formation d'une première couche barrière inorganique sur le substrat d'élément ; une étape de condensation d'une résine photodurcissable sur la première couche barrière inorganique ; une étape d'irradiation, au moyen d'un faisceau laser, d'une pluralité de zones sélectionnées de la résine photodurcissable, et de durcissement d'au moins une partie de la résine photodurcissable pour former une couche de résine photodurcie ; une étape d'élimination d'une partie non durcie de la résine photodurcissable ; et une étape de formation, sur la première couche barrière inorganique, d'une seconde couche barrière inorganique qui recouvre la couche de résine photodurcie.
(JA) 本開示の有機ＥＬデバイスの製造方法は、基板と、前記基板上に配列された複数の有機ＥＬデバイスとを備える素子基板を用意する工程と、前記素子基板に薄膜封止構造を形成する工程とを含む。薄膜封止構造を形成する工程は、第１無機バリア層を素子基板上に形成する工程と、第１無機バリア層上に光硬化性樹脂を凝縮させる工程と、レーザビームによって光硬化性樹脂の選択された複数の領域を照射し、光硬化性樹脂の少なくとも一部を硬化させて光硬化樹脂層を形成する工程と、光硬化性樹脂の硬化しなかった部分を除去する工程と、光硬化樹脂層を覆う第２無機バリア層を前記第１無機バリア層上に形成する工程とを含む。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)