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1. (WO2018163256) FRICTION MATERIAL COMPOSITION, FRICTION MATERIAL, AND FRICTION MEMBER
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Pub. No.: WO/2018/163256 International Application No.: PCT/JP2017/008849
Publication Date: 13.09.2018 International Filing Date: 06.03.2017
IPC:
C09K 3/14 (2006.01) ,F16D 69/02 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
14
Anti-slip materials; Abrasives
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16
ENGINEERING ELEMENTS OR UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
D
COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
69
Friction linings; Attachment thereof; Selection of coacting friction substances or surfaces
02
Composition of linings
Applicants:
日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 東京都千代田区丸の内一丁目9番2号 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors:
馬場 一也 BABA, Kazuya; JP
永吉 央幸 NAGAYOSHI, Teruyuki; JP
福澤 雄一 FUKUZAWA, Yuichi; JP
Agent:
大谷 保 OHTANI, Tamotsu; JP
平澤 賢一 HIRASAWA, Kenichi; JP
澤山 要介 SAWAYAMA, Yosuke; JP
Priority Data:
Title (EN) FRICTION MATERIAL COMPOSITION, FRICTION MATERIAL, AND FRICTION MEMBER
(FR) COMPOSITION DE MATÉRIAU DE FRICTION, MATÉRIAU DE FRICTION, ET ÉLÉMENT DE FRICTION
(JA) 摩擦材組成物、摩擦材および摩擦部材
Abstract:
(EN) Provided are: a friction material composition capable of yielding a friction material free of copper or having a reduced copper content, the friction material having a stable friction coefficient after standing in a cold environment, exceptional abrasion resistance and low rust adhesion, and suppressed squealing (especially low-temperature squealing); a friction material obtained by molding said friction material composition; and a friction member in which said friction material is used. The friction material composition specifically contains a binder, an organic filler, an inorganic filler, and a fiber substrate, wherein: the friction material composition does not contain copper or, even if the friction material composition contains copper, has a copper content of less than 0.5% by mass as elemental copper; and the friction material composition contains cashew particles having silicone resin bonded thereto as the organic filler.
(FR) L'invention concerne : une composition de matériau de friction permettant d'obtenir un matériau de friction exempt de cuivre ou ayant une teneur en cuivre réduite, le matériau de friction ayant un coefficient de friction stable après être resté dans un environnement froid, une résistance à l'abrasion exceptionnelle et une faible adhérence à la rouille, et un grincement supprimé (en particulier un grincement à basse température) ; un matériau de friction obtenu par moulage de ladite composition de matériau de friction ; et un élément de friction dans lequel ledit matériau de friction est utilisé. La composition de matériau de friction contient spécifiquement un liant, une charge organique, une charge inorganique et un substrat de fibre. La composition de matériau de friction ne contient pas de cuivre ou, même si la composition de matériau de friction contient du cuivre, elle a une teneur en cuivre inférieure à 0,5 % en masse sous forme de cuivre élémentaire, et la composition de matériau de friction contient des particules de cajou auxquelles une résine silicone est liée en tant que charge organique.
(JA) 銅を含有しないか、または銅の含有量を低減した摩擦材において、寒冷環境下に放置後の摩擦係数の安定性、耐摩耗性および低錆固着性に優れ、且つ鳴き(特に低温鳴き)が抑制された摩擦材を与えることができる摩擦材組成物、ならびに該摩擦材組成物を成形してなる摩擦材、および該摩擦材を用いた摩擦部材を提供する。前記摩擦材組成物は、具体的には、結合材、有機充填材、無機充填材および繊維基材を含有する摩擦材組成物であって、該摩擦材組成物は、銅を含まないか、または銅を含んでいても該銅の含有率は銅元素として0.5質量%未満であり、且つ、前記有機充填材として、シリコーン樹脂が付着したカシューパーティクルを含有する摩擦材組成物である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)