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1. (WO2018163235) LASER LIGHT SOURCE UNIT
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Pub. No.: WO/2018/163235 International Application No.: PCT/JP2017/008723
Publication Date: 13.09.2018 International Filing Date: 06.03.2017
IPC:
H01S 5/022 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
022
Mountings; Housings
Applicants:
三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors:
関 俊秀 SEKI Toshihide; JP
Agent:
吉竹 英俊 YOSHITAKE Hidetoshi; JP
有田 貴弘 ARITA Takahiro; JP
Priority Data:
Title (EN) LASER LIGHT SOURCE UNIT
(FR) UNITÉ DE SOURCE DE LUMIÈRE LASER
(JA) レーザ光源ユニット
Abstract:
(EN) A housing 10 is provided with a groove V1a, into which an electrode 3b of a laser oscillation element 30a, and an electrode 3a of a laser oscillation element 30b are inserted. In the groove V1a, there is a conductive layer 12 that electrically connects the electrode 3b of the laser oscillation element 30a, and the electrode 3a of the laser oscillation element 30b to each other.
(FR) L'invention concerne un boîtier 10 comprenant une rainure V1a, dans laquelle une électrode 3b d'un élément d'oscillation laser 30a, et une électrode 3a d'un élément d'oscillation laser 30b sont insérées. Dans la rainure V1a, se trouve une couche conductrice 12 qui connecte électriquement l'électrode 3b de l'élément d'oscillation laser 30a, et l'électrode 3a de l'élément d'oscillation laser 30b l'une à l'autre.
(JA) 筐体10には、レーザ発振素子30aの電極3bと、レーザ発振素子30bの電極3aとが挿入されている溝V1aが設けられている。溝V1aの内部には、レーザ発振素子30aの電極3bと、レーザ発振素子30bの電極3aとを電気的に接続する導電層12が存在する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)