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1. (WO2018162583) SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING AT LEAST ONE SEMICONDUCTOR COMPONENT

Pub. No.:    WO/2018/162583    International Application No.:    PCT/EP2018/055653
Publication Date: Fri Sep 14 01:59:59 CEST 2018 International Filing Date: Thu Mar 08 00:59:59 CET 2018
IPC: H01L 21/78
H01L 33/00
Applicants: OSRAM OPTO SEMICONDUCTORS GMBH
Inventors: ZITZLSPERGER, Michael
KÜHNELT, Michael
REITH, Andreas
NAGEL, Peter
Title: SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING AT LEAST ONE SEMICONDUCTOR COMPONENT
Abstract:
The invention relates to a method for producing at least one semiconductor component (11), having the following steps: - providing at least one semiconductor chip (1) which comprises the following: - a chip substrate (2), - a semiconductor layer sequence (3) which is arranged on the chip substrate (2), - a first main surface (1A) and a second main surface (1B) lying opposite the first main surface (1A), and - at least one lateral surface (1C) which is arranged transversely to the first and second main surface (1A, 1B), wherein the semiconductor chip (1) has traces (8) of a separation process on the lateral surface (1C); - providing a support (9) with a mounting surface (9A); - mounting the at least one semiconductor chip (1) on the support (9), said first main surface (1A) of the at least one semiconductor chip (1) being connected to the mounting surface (9A) of the support (9); and - etching the semiconductor chip (1) on the lateral surface (1C). The invention additionally relates to a semiconductor component (11) which can be produced using such a method.