Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018162263) LOW PROFILE SURFACE MOUNT MICROPHONE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/162263 International Application No.: PCT/EP2018/054616
Publication Date: 13.09.2018 International Filing Date: 26.02.2018
Chapter 2 Demand Filed: 25.06.2018
IPC:
H04R 19/04 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
R
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19
Electrostatic transducers
04
Microphones
Applicants:
G.R.A.S. SOUND & VIBRATION A/S [DK/DK]; Skovlytoften 33 2840 Holte, DK
Inventors:
BOVIN, Jonas Kabell; DK
MARBJERG, Kresten; DK
MEHR, Ulrik; DK
Agent:
SCHWARZ & PARTNER PATENTANWÄLTE OG; Wipplingerstrasse 30 1010 Wien, AT
ROEGGLA, Harald; AT
Priority Data:
17159485.607.03.2017EP
Title (EN) LOW PROFILE SURFACE MOUNT MICROPHONE
(FR) MICROPHONE À MONTAGE EN SURFACE DISCRET
Abstract:
(EN) A surface mountable condenser microphone (1) comprising a diaphragm (7) spaced by a spacer from a conductive capacitor layer (14), which is arranged on a surface of a back plate (15), wherein the back plate (15) is realized by a ceramic plate that carries the conductive capacitor layer (14) and isolated on another surface area of the same side of the back plate (15) a spacer layer (23) that projects over the conductive capacitor layer (14) and forms the spacer.
(FR) Un microphone à condensateur (1) montable en surface comprend une membrane (7) espacée d'une couche de condensateur conductrice (14) par un espaceur, la couche de condensateur conductrice étant disposée sur une surface d'une plaque arrière (15), la plaque arrière (15) étant réalisée au moyen d'une plaque céramique qui porte la couche de condensateur conductrice (14) et isole sur une autre zone de surface du même côté de la plaque arrière (15) une couche d'espacement (23) qui fait saillie sur la couche de condensateur conductrice (14) et forme l'espaceur.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)