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1. (WO2018162141) COMPOSITE OF HEAT SINK AND ELECTRICAL AND/OR ELECTRONIC COMPONENT

Pub. No.:    WO/2018/162141    International Application No.:    PCT/EP2018/051699
Publication Date: Fri Sep 14 01:59:59 CEST 2018 International Filing Date: Thu Jan 25 00:59:59 CET 2018
IPC: C09K 5/00
H01L 23/34
H05K 7/20
B33Y 80/00
Applicants: SIEMENS AKTIENGESELLSCHAFT
Inventors: EDER, Florian
MUHRER, Volker
PIHALE, Sven
Title: COMPOSITE OF HEAT SINK AND ELECTRICAL AND/OR ELECTRONIC COMPONENT
Abstract:
The invention relates to electrical and/or electronic components such as power circuit breakers and motors having a novel cooling system. The invention provides, for the first time, a composite of a cooling system and an electrical and/or electronic component, with which the heat transfer is optimised by reducing the material transitions in such a manner that the composite is joined by the formation of chemical bonds, in particular including covalent bonds. To produce the composite, 3D printing methods can be used, the surface to be cooled being usable directly or indirectly as the printing bed.