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1. (WO2018161549) MANUFACTURING METHOD FOR DISPLAY SUBSTRATE, DISPLAY SUBSTRATE, AND DISPLAY DEVICE
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Pub. No.: WO/2018/161549 International Application No.: PCT/CN2017/104432
Publication Date: 13.09.2018 International Filing Date: 29.09.2017
IPC:
H01L 27/12 (2006.01) ,H01L 21/77 (2017.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02
including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12
the substrate being other than a semiconductor body, e.g. an insulating body
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
Applicants:
京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN/CN]; 中国北京市 朝阳区酒仙桥路10号 No.10 Jiuxianqiao Rd., Chaoyang District Beijing 100015, CN
重庆京东方光电科技有限公司 CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN/CN]; 中国重庆市 北碚区水土高新技术产业园云汉大道7号 No.7 Yunhan Rd., Shuitu Hi-tech Industrial Zone, Beibei District Chongqing 400714, CN
Inventors:
王小元 WANG, Xiaoyuan; CN
方琰 FANG, Yan; CN
张逵 ZHANG, Kui; CN
许志财 XU, Zhicai; CN
邓鸣 DENG, Ming; CN
Agent:
北京市柳沈律师事务所 LIU, SHEN & ASSOCIATES; 中国北京市 海淀区彩和坊路10号1号楼10层 10th Floor, Building 1, 10 Caihefang Road Haidian District Beijing 100080, CN
Priority Data:
201710142159.010.03.2017CN
Title (EN) MANUFACTURING METHOD FOR DISPLAY SUBSTRATE, DISPLAY SUBSTRATE, AND DISPLAY DEVICE
(FR) PROCÉDÉ DE FABRICATION DE SUBSTRAT D'AFFICHAGE, SUBSTRAT D'AFFICHAGE ET DISPOSITIF D'AFFICHAGE
(ZH) 显示基板的制作方法、显示基板和显示装置
Abstract:
(EN) Provided are a manufacturing method for a display substrate, a display substrate, and a display device. The manufacturing method for a display substrate comprises: forming an insulating layer (135) on a base substrate (101), the base substrate (101) comprising a display region (10) and a peripheral region (01); forming a planarization film (1080) on the insulating layer (135); patterning the planarization film (1080); forming a planarization layer (108) having a first thickness in the display region (10); forming a planarization layer (0108) having a second thickness in the peripheral region (01); forming a first via hole (0131) in the planarization layer (0108) having the second thickness, the second thickness being less than the first thickness; etching the peripheral region (01) to thin or remove the planarization layer (0108) having the second thickness; and forming, in the insulating layer (135), a second via hole (0132) corresponding to the first via hole (0131). Said manufacturing method for the display substrate facilitates the reduction of the thickness of the planarization layer in the peripheral region, facilitates connection between a first conductive unit and a second conductive unit, and facilitates connection between the second conductive unit and a driving circuit, the contact area being large, the contact resistance being low, and the connectivity being good.
(FR) L'invention concerne un procédé de fabrication d'un substrat d'affichage, un substrat d'affichage et un dispositif d'affichage. Le procédé de fabrication d'un substrat d'affichage consiste à : former une couche d'isolation (135) sur un substrat de base (101), le substrat de base (101) comprenant une région d'affichage (10) et une région périphérique (01); former un film de planarisation (1080) sur la couche d'isolation (135); modeler le film de planarisation (1080); former une couche de planarisation (108) ayant une première épaisseur dans la région d'affichage (10); former une couche de planarisation (0108) ayant une seconde épaisseur dans la région périphérique (01); former un premier trou d'interconnexion (0131) dans la couche de planarisation (0108) ayant la seconde épaisseur, la seconde épaisseur étant inférieure à la première épaisseur; graver la région périphérique (01) pour amincir ou retirer la couche de planarisation (0108) ayant la seconde épaisseur; et former, dans la couche d'isolation (135), un second trou d'interconnexion (0132) correspondant au premier trou d'interconnexion (0131). Ledit procédé de fabrication du substrat d'affichage facilite la réduction de l'épaisseur de la couche de planarisation dans la région périphérique, facilite la connexion entre une première unité conductrice et une seconde unité conductrice, et facilite la connexion entre la seconde unité conductrice et un circuit d'attaque, la zone de contact étant grande, la résistance de contact étant faible, et la connectivité étant bonne.
(ZH) 提供一种显示基板的制作方法、显示基板和显示装置。该显示基板的制作方法,包括:在衬底基板(101)上形成绝缘层(135),衬底基板(101)包括显示区(10)和周边区(01);在绝缘层(135)上形成平坦膜(1080);对平坦膜(1080)进行图案化工艺,在显示区(10)形成第一厚度的平坦层(108),在周边区(01)形成第二厚度的平坦层(0108),且在第二厚度的平坦层(0108)中形成第一过孔(0131),第二厚度小于第一厚度;对周边区(01)进行刻蚀处理,以使第二厚度的平坦层(0108)被减薄或去除,且在绝缘层(135)中形成与第一过孔(0131)对应的第二过孔(0132)。该显示基板的制作方法,利于减小周边区的平坦层的厚度,利于第一导电单元和第二导电单元之间的连接,并利于第二导电单元与驱动电路连接,接触面积大,接触电阻小,连接性好。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)