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1. (WO2018161437) POWER MODULE AND MANUFACTURING METHOD THEREFOR

Pub. No.:    WO/2018/161437    International Application No.:    PCT/CN2017/085950
Publication Date: Fri Sep 14 01:59:59 CEST 2018 International Filing Date: Fri May 26 01:59:59 CEST 2017
IPC: H01L 23/29
Applicants: GUANGDONG MIDEA REFRIGERATION APPLIANCES CO., LTD.
广东美的制冷设备有限公司
Inventors: WANG, Xinlei
王新雷
FENG, Yuxiang
冯宇翔
Title: POWER MODULE AND MANUFACTURING METHOD THEREFOR
Abstract:
Disclosed in the present invention are a power module and a manufacturing method therefor. The power module comprises: a power module body, comprising a circuit substrate and electronic components fixedly provided on the circuit substrate, the electronic components being electrically connected to circuit wirings of the circuit substrate; an epoxy plastic packaging layer, formed by plastic packaging of an epoxy plastic packaging material and covering the power module body; an anti-water absorption layer, formed by an anti-water absorption material and covering an outer surface of the epoxy plastic packaging layer; and a wiring pin, electrically connected to the circuit wirings of the circuit substrate and passing through the epoxy plastic packaging layer and the anti-water absorption layer in a sealing manner, and some of the wiring pin being exposed outside of the anti-water absorption layer. The technical solution of the present invention can reduce the water absorption property of the power module, improve moisture resistance property of the power module, and further improve service life of the power module.