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1. (WO2018161082) METHODS AND APPARATUS PROVIDING A GRADED PACKAGE FOR A SEMICONDUCTOR
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Pub. No.: WO/2018/161082 International Application No.: PCT/US2018/020936
Publication Date: 07.09.2018 International Filing Date: 05.03.2018
IPC:
H01L 23/544 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
544
Marks applied to semiconductor devices, e.g. registration marks, test patterns
Applicants:
TEXAS INSTRUMENTS INCORPORATED [US/US]; P.O. Box 655474, Mail Station 3999 Dallas, TX 75265-5474, US
TEXAS INSTRUMENTS JAPAN LIMITED [JP/JP]; 24-1, Nishi-shinjuku 6-chome Shinjuku-ku Tokyo, 160-8366, JP (JP)
Inventors:
REVIER, Daniel, Lee; US
COOK, Benjamin, Stassen; US
Agent:
DAVIS, Jr., Michael A.; US
Common
Representative:
TEXAS INSTRUMENTS INCORPORATED; P.O. Box 655474, Mail Station 3999 Dallas, TX 75265-5474, US
Priority Data:
15/620,36112.06.2017US
62/466,38503.03.2017US
Title (EN) METHODS AND APPARATUS PROVIDING A GRADED PACKAGE FOR A SEMICONDUCTOR
(FR) PROCÉDÉS ET APPAREIL POUR FOURNIR UN BOÎTIER ÉTAGÉ POUR SEMI-CONDUCTEUR
Abstract:
(EN) To provide a graded package for a semiconductor, an example apparatus includes a die (118); and a graded package (102) encapsulating the die (118). The graded package (102) includes a material (106) that is spatially varied from a first location of the graded package (102) to a second location of the graded package (102).
(FR) Pour fournir un boîtier gradué pour un semi-conducteur, un appareil donné à titre d'exemple de la présente invention comprend une puce (118), et un boîtier étage (102) encapsulant la puce (118). Le boîtier étagé (102) comprend un matériau (106) qui varie spatialement d'un premier emplacement du boîtier étagé (102) à un second emplacement du boîtier étagé (102).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)