Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018160844) COMPUTED TOMOGRAPHY USING INTERSECTING VIEWS OF PLASMA USING OPTICAL EMISSION SPECTROSCOPY DURING PLASMA PROCESSING
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/160844 International Application No.: PCT/US2018/020463
Publication Date: 07.09.2018 International Filing Date: 01.03.2018
IPC:
A61B 5/00 (2006.01)
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
B
DIAGNOSIS; SURGERY; IDENTIFICATION
5
Measuring for diagnostic purposes; Identification of persons
Applicants:
TOKYO ELECTRON LIMITED [JP/JP]; Akasaka Biz Tower 3-1 Akasaka 5-chome Minato-ku, Tokyo 107-6325, JP
TOKYO ELECTRON U.S. HOLDINGS, INC. [US/US]; 2400 Grove Boulevard Austin, Texas 78741, US (JP)
Inventors:
HAN, Taejoon; US
MORVAY, Daniel; US
VUKOVIC, Mirko; US
Agent:
OBLON, Norman F.; US
Priority Data:
15/448,06902.03.2017US
Title (EN) COMPUTED TOMOGRAPHY USING INTERSECTING VIEWS OF PLASMA USING OPTICAL EMISSION SPECTROSCOPY DURING PLASMA PROCESSING
(FR) TOMOGRAPHIE ASSISTÉE PAR ORDINATEUR UTILISANT DES VUES D'INTERSECTION DE PLASMA À L'AIDE D'UNE SPECTROSCOPIE D'ÉMISSION OPTIQUE PENDANT UN TRAITEMENT AU PLASMA
Abstract:
(EN) Described herein are technologies to facilitate computed tomographic techniques to help identifying chemical species during plasma processing of a substrate (e.g., semiconductor wafer) using optical emission spectroscopy (OES). More particularly, the technology described herein uses topographic techniques to spatially resolves emissions and absorptions in at least two-dimension space above the substrate during the plasma processing (e.g., etching) of the substrate. With some implementations utilize optical detectors positioned along multiple axes (e.g., two or more) to receive incident incoming optical spectra from the plasma chamber during the plasma processing (e.g., etching) of the substrate. Because of the multi-axes arrangement, the incident incoming optical spectra form an intersecting grid.
(FR) L'invention concerne des technologies permettant de faciliter des techniques tomographiques assistées par ordinateur pour aider à identifier des espèces chimiques pendant le traitement au plasma d'un substrat (par exemple, une tranche de semi-conducteur) à l'aide d'une spectroscopie d'émission optique (OES). Plus précisément, la technologie de l’invention utilise des techniques topographiques pour résoudre spatialement les émissions et les absorptions dans au moins un espace à deux dimensions au-dessus du substrat pendant le traitement au plasma (par exemple, la gravure) du substrat. Certains modes de réalisation utilisent des détecteurs optiques positionnés le long de multiples axes (par exemple, au moins deux) pour recevoir des spectres optiques entrants incidents provenant de la chambre à plasma pendant le traitement au plasma (par exemple, la gravure) du substrat. Grâce à l'agencement à axes multiples, les spectres optiques entrants incidents forment une grille d'intersection.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)