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1. (WO2018159738) SOLID-STATE IMAGE CAPTURE DEVICE AND ELECTRONIC DEVICE
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Pub. No.: WO/2018/159738 International Application No.: PCT/JP2018/007703
Publication Date: 07.09.2018 International Filing Date: 01.03.2018
IPC:
H01L 27/146 (2006.01) ,G02B 5/30 (2006.01) ,H01L 31/0232 (2014.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
5
Optical elements other than lenses
30
Polarising elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
0232
Optical elements or arrangements associated with the device
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 神奈川県厚木市旭町四丁目14番1号 4-14-1, Asahi-cho, Atsugi-shi, Kanagawa 2430014, JP
Inventors:
戸田 淳 TODA Atsushi; JP
Agent:
西川 孝 NISHIKAWA Takashi; JP
稲本 義雄 INAMOTO Yoshio; JP
Priority Data:
2017-04013203.03.2017JP
Title (EN) SOLID-STATE IMAGE CAPTURE DEVICE AND ELECTRONIC DEVICE
(FR) DISPOSITIF DE CAPTURE D'IMAGE À SEMICONDUCTEUR ET DISPOSITIF ÉLECTRONIQUE
(JA) 固体撮像装置および電子機器
Abstract:
(EN) The disclosure of the present invention pertains to: a solid-state image capture device that enables a normal vector to be accurately estimated in one direction, with a simple configuration; and an electronic device. A polarization image sensor is disposed on a chip and comprises: a plurality of polarizers having different polarization directions; and a plurality of photo diodes in which light-receiving regions that receive light which passed through the polarizers are symmetrical. The disclosure of the present invention can be applied to, for example, a polarization image sensor that estimates the surface and shape of a subject.
(FR) La présente invention concerne : un dispositif de capture d'image à semiconducteur qui permet d'estimer avec précision un vecteur normal dans une direction, avec une configuration simple; et un dispositif électronique. Un capteur d'image de polarisation est disposé sur une puce et comprend : une pluralité de polariseurs ayant des directions de polarisation différentes; et une pluralité de photodiodes dans lesquelles des régions de réception de lumière qui reçoivent de la lumière qui a traversé les polariseurs sont symétriques. La présente invention peut être appliquée, par exemple, à un capteur d'image de polarisation qui estime la surface et la forme d'un objet.
(JA) 本開示は、簡単な構成で、法線ベクトルを一つの方向に精度良く見積もることができるようにする固体撮像装置および電子機器に関する。 偏光イメージセンサは、チップ上に配置され、異なる偏光方向を有する複数の偏光子と、偏光子を透過した光を受光する受光領域が対称な複数のフォトダイオードとを備える。本開示は、例えば、被写体の表面及び形状を推定する偏光イメージセンサ等に適用できる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)