Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018159728) MOUNTING STRUCTURE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/159728 International Application No.: PCT/JP2018/007667
Publication Date: 07.09.2018 International Filing Date: 01.03.2018
IPC:
H05K 1/18 (2006.01) ,H05K 3/34 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
住友電工プリントサーキット株式会社 SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. [JP/JP]; 滋賀県甲賀市水口町ひのきが丘30番地 30, Hinokigaoka, Minakuchi-cho, Koka-shi, Shiga 5280068, JP
Inventors:
森田 真介 MORITA Shinsuke; JP
Agent:
二島 英明 NISHIMA Hideaki; JP
中田 元己 NAKATA Motomi; JP
森田 剛史 MORITA Takeshi; JP
高城 政浩 TAKAGI Masahiro; JP
緒方 大介 OGATA Daisuke; JP
Priority Data:
2017-03979602.03.2017JP
Title (EN) MOUNTING STRUCTURE
(FR) STRUCTURE DE MONTAGE
(JA) 実装構造
Abstract:
(EN) The present invention provides a mounting structure for allowing a plurality of terminals of a mounting component to be self-aligned with a plurality of lands on a wiring board by solder reflow. In the mounting structure, the lands and the terminals have a planar shape comprising a combination of one or a plurality of rectangles. The position of the center of gravity of a land main portion with the largest area among the one or a plurality of rectangles of the planar shape of the lands coincides with the position of the center of gravity of a terminal main portion with the largest area among the one or a plurality of rectangles of the planar shape of the terminals.
(FR) La présente invention concerne une structure de montage pour permettre à une pluralité de bornes d'un composant de montage d'être auto-alignées avec une pluralité de méplats sur une carte de câblage par refusion. Dans la structure de montage, les méplats et les bornes ont une forme plane comprenant une combinaison d'un ou d'une pluralité de rectangles. La position du centre de gravité d'une partie principale de terrain avec la plus grande surface parmi le ou les rectangles de la forme plane des méplats coïncide avec la position du centre de gravité d'une partie principale de terminal avec la plus grande zone parmi le ou les rectangles de la forme plane des terminaux.
(JA) 本発明の実装構造は、配線板の複数のランドに実装部品の複数の端子を半田のリフローによりセルフアライメントする実装構造であって、上記ランド及び端子の平面形状が1又は複数の方形を組み合わせたものであり、上記ランドの平面形状の1又は複数の方形のうち面積が最大のランド主部の重心位置と、上記端子の平面形状の1又は複数の方形のうち面積が最大の端子主部の重心位置とが一致する。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)