Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018159629) PHOTOSENSITIVE RESIN COMPOSITION
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/159629 International Application No.: PCT/JP2018/007320
Publication Date: 07.09.2018 International Filing Date: 27.02.2018
IPC:
G03F 7/031 (2006.01) ,C07C 13/58 (2006.01) ,C07C 43/20 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/027 (2006.01) ,G03F 7/033 (2006.01) ,G03F 7/20 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028
with photosensitivity-increasing substances, e.g. photoinitiators
031
Organic compounds not covered by group G03F7/02967
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
C
ACYCLIC OR CARBOCYCLIC COMPOUNDS
13
Cyclic hydrocarbons containing rings other than, or in addition to, six-membered aromatic rings
28
Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof
32
with condensed rings
54
with three condensed rings
573
with three six-membered rings
58
Completely or partially hydrogenated anthracenes
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
C
ACYCLIC OR CARBOCYCLIC COMPOUNDS
43
Ethers; Compounds having groups, groups or groups
02
Ethers
20
having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032
with binders
033
the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
Applicants:
旭化成株式会社 ASAHI KASEI KABUSHIKI KAISHA [JP/JP]; 東京都千代田区有楽町一丁目1番2号 1-1-2 Yurakucho, Chiyoda-ku, Tokyo 1000006, JP
Inventors:
山田 有里 YAMADA, Yuri; JP
小坂 隼也 KOSAKA, Junya; JP
松田 隆之 MATSUDA, Takayuki; JP
Agent:
青木 篤 AOKI, Atsushi; JP
三橋 真二 MITSUHASHI, Shinji; JP
中村 和広 NAKAMURA, Kazuhiro; JP
齋藤 都子 SAITO, Miyako; JP
三間 俊介 MIMA, Shunsuke; JP
Priority Data:
2017-03826501.03.2017JP
2017-16405529.08.2017JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE
(JA) 感光性樹脂組成物
Abstract:
(EN) The present invention provides a photosensitive resin composition that is used for two-wavelength exposure and exhibits excellent exposure sensitivity, adhesion, and resolution. This photosensitive resin composition is used for production of a cured resin product through exposure using first active light having a central wavelength less than 390 nm and second active light having a central wavelength of at least 390 nm, wherein the photosensitive resin composition contains an alkali-soluble polymer (A), a compound (B) having an ethylenic double bond, and a photopolymerization initiator (C); the photosensitive resin composition is sensitive to both the first active light and the second active light; and the photopolymerization initiator (C) contains anthracene and/or an anthracene derivative.
(FR) L’invention fournit une composition de résine photosensible qui est mise en œuvre dans une exposition à deux longueurs d’onde, et qui confère d’excellentes propriétés en termes de sensibilité à l’exposition, d’adhésion et de résolution. Plus précisément, l’invention concerne une composition de résine photosensible qui est destinée à obtenir un article durci en résine par exposition au moyen d’une première lumière active de longueur d’onde centrale inférieure à 390nm, et d’une seconde lumière active de longueur d’onde centrale supérieure ou égale à 390nm. Ladite composition de résine photosensible contient un polymère soluble dans l’alcali (A), un composé (B) possédant une liaison double éthylénique, et un initiateur de photopolymérisation (C). Ladite composition de résine photosensible présente une photosensibilité vis-à-vis à la fois de ladite première et de ladite seconde lumière active. L’initiateur de photopolymérisation (C) contient un anthracène et/ou un dérivé d’anthracène.
(JA) 2波長露光に使用され、優れた露光感度、密着性及び解像性を与える感光性樹脂組成物を提供する。中心波長390nm未満の第1の活性光と、中心波長390nm以上の第2の活性光とで露光して樹脂硬化物を得るための感光性樹脂組成物であって、前記感光性樹脂組成物は、(A)アルカリ可溶性高分子、(B)エチレン性二重結合を有する化合物、及び(C)光重合開始剤を含み、前記感光性樹脂組成物は、前記第1の活性光及び前記第2の活性光の両者に対する感光性を有し、前記(C)光重合開始剤はアントラセン及び/又はアントラセン誘導体を含む感光性樹脂組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)