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1. (WO2018159619) SEALING SHEET AND SEMICONDUCTOR-DEVICE MANUFACTURING METHOD

Pub. No.:    WO/2018/159619    International Application No.:    PCT/JP2018/007288
Publication Date: Sat Sep 08 01:59:59 CEST 2018 International Filing Date: Wed Feb 28 00:59:59 CET 2018
IPC: H01L 23/29
C09C 1/28
C09C 1/40
C09C 3/12
C09J 11/04
C09J 11/06
C09J 201/00
H01L 21/56
H01L 23/31
Applicants: LINTEC CORPORATION
リンテック株式会社
Inventors: WATANABE Yasutaka
渡邉 康貴
NEZU Yusuke
根津 裕介
SUGINO Takashi
杉野 貴志
Title: SEALING SHEET AND SEMICONDUCTOR-DEVICE MANUFACTURING METHOD
Abstract:
In a semiconductor-device manufacturing method including a treatment step in which an alkaline solution is used, the present invention provides a sealing sheet 1 that is used for sealing a semiconductor chip incorporated in a substrate or sealing a semiconductor chip on an adhesive sheet. The sealing sheet 1 is provided with at least a curable adhesive layer 11, and the adhesive layer 11 is formed from an adhesive composition containing a thermosetting resin, a thermoplastic resin, and an inorganic filler surface-treated with a surface treatment agent having a minimum coating area of less than 550 m2/g. With the sealing sheet 1, swelling of metal plating is less likely to occur.