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|1. (WO2018159619) SEALING SHEET AND SEMICONDUCTOR-DEVICE MANUFACTURING METHOD|
|Title:||SEALING SHEET AND SEMICONDUCTOR-DEVICE MANUFACTURING METHOD|
In a semiconductor-device manufacturing method including a treatment step in which an alkaline solution is used, the present invention provides a sealing sheet 1 that is used for sealing a semiconductor chip incorporated in a substrate or sealing a semiconductor chip on an adhesive sheet. The sealing sheet 1 is provided with at least a curable adhesive layer 11, and the adhesive layer 11 is formed from an adhesive composition containing a thermosetting resin, a thermoplastic resin, and an inorganic filler surface-treated with a surface treatment agent having a minimum coating area of less than 550 m2/g. With the sealing sheet 1, swelling of metal plating is less likely to occur.