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1. (WO2018159564) RESIN COMPOSITION
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Pub. No.: WO/2018/159564 International Application No.: PCT/JP2018/007070
Publication Date: 07.09.2018 International Filing Date: 27.02.2018
IPC:
C08L 63/00 (2006.01) ,C08K 3/40 (2006.01) ,C08K 5/37 (2006.01) ,C08K 7/00 (2006.01) ,C09K 3/10 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
40
Glass
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
36
Sulfur-, selenium-, or tellurium-containing compounds
37
Thiols
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
10
for sealing or packing joints or covers
Applicants:
味の素株式会社 AJINOMOTO CO., INC. [JP/JP]; 東京都中央区京橋一丁目15番1号 15-1, Kyobashi 1-chome, Chuo-ku, Tokyo 1048315, JP
Inventors:
田村 賢 TAMURA, Masaru; JP
Agent:
高島 一 TAKASHIMA, Hajime; JP
鎌田 光宜 KAMADA, Mitsunori; JP
Priority Data:
2017-03701328.02.2017JP
Title (EN) RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE
(JA) 樹脂組成物
Abstract:
(EN) Provided is a resin composition having low viscosity, high fluidity, excellent shelf life and low-temperature curability. The cured product of the resin composition has very high moisture permeation resistance. The composition comprises (A) an epoxy resin, (B) a polythiol compound, and (C) a glass in flake form.
(FR) L’invention fournit une composition de résine dont la viscosité est faible, qui présente une fluidité élevée, qui est dotée d’excellentes propriétés de stabilité de conservation et de durcissement à basse température, et qui est telle qu’un article durci de celle-ci présente une résistance extrêmement élevée à la perméation d’humidité. Plus précisément, l’invention concerne une composition de résine qui contient (A) une résine époxy, (B) un composé polythiol et (C) un verre en paillettes.
(JA) 粘度が低く、高流動性であり、保存安定性及び低温硬化性に優れ、しかも、その硬化物が極めて高い耐透湿性を有する樹脂組成物を提供する。 (A)エポキシ樹脂、(B)ポリチオール化合物及び(C)フレーク状ガラスを含む樹脂組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)