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1. (WO2018159506) RESIN COMPOSITION, LAMINATE FOR CIRCUIT BOARDS, METAL-BASED CIRCUIT BOARD AND POWER MODULE

Pub. No.:    WO/2018/159506    International Application No.:    PCT/JP2018/006798
Publication Date: Sat Sep 08 01:59:59 CEST 2018 International Filing Date: Sat Feb 24 00:59:59 CET 2018
IPC: C08G 73/00
B32B 15/08
C08G 59/40
H05K 1/05
Applicants: NHK SPRING CO., LTD.
日本発條株式会社
Inventors: MIZUNO, Katsumi
水野 克美
IKEDA, Daiki
池田 大記
OKUNO, Akifumi
奥野 彰史
WADA, Yoko
和田 陽子
Title: RESIN COMPOSITION, LAMINATE FOR CIRCUIT BOARDS, METAL-BASED CIRCUIT BOARD AND POWER MODULE
Abstract:
Provided is a resin composition which contains a bisphenol type cyanate resin, a novolac type cyanate resin and a curing accelerator. The resin composition contains, as the curing accelerator, a benzoxazine compound and a compound that is derived from a benzoxazine compound and has a phenolic hydroxyl group, while having a crosslinked structure I wherein the bisphenol type cyanate resin and the novolac type cyanate resin are crosslinked with each other and a crosslinked structure II wherein at least one of the bisphenol type cyanate resin and the novolac type cyanate resin and the compound that is derived from a benzoxazine compound and has a phenolic hydroxyl group are crosslinked with each other.