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1. (WO2018159481) LAYERED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING LAYERED ELECTRONIC COMPONENT

Pub. No.:    WO/2018/159481    International Application No.:    PCT/JP2018/006664
Publication Date: Sat Sep 08 01:59:59 CEST 2018 International Filing Date: Sat Feb 24 00:59:59 CET 2018
IPC: H01F 27/36
H01F 27/00
H01F 41/04
H01G 4/224
H01G 4/30
H03H 7/01
H05K 9/00
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: MIYAHARA, Kunihiro
宮原 邦浩
Title: LAYERED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING LAYERED ELECTRONIC COMPONENT
Abstract:
Provided is a layered electronic component in which a shielding film is less likely to be separated from a surface of a laminated body. The present invention is provided with: a laminated body 1 which includes a plurality of stacked insulator layers and which has a bottom surface B, a top surface T, and a plurality of side surfaces S; and a shielding film 4 formed on the side surfaces S of the laminated body 1, wherein at least one step 3 is formed on a ridge line where the bottom surface B and the side surfaces S of the laminated body 1 are in contact with each other, and an edge 4a of the shielding film 4 is disposed inside the step 3. In other words, a portion of the edge 4a of the shielding film 4 which easily becomes a starting point of separation is located inside the step 3 so as to be protected.