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|1. (WO2018159481) LAYERED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING LAYERED ELECTRONIC COMPONENT|
|Applicants:||MURATA MANUFACTURING CO., LTD.
|Title:||LAYERED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING LAYERED ELECTRONIC COMPONENT|
Provided is a layered electronic component in which a shielding film is less likely to be separated from a surface of a laminated body. The present invention is provided with: a laminated body 1 which includes a plurality of stacked insulator layers and which has a bottom surface B, a top surface T, and a plurality of side surfaces S; and a shielding film 4 formed on the side surfaces S of the laminated body 1, wherein at least one step 3 is formed on a ridge line where the bottom surface B and the side surfaces S of the laminated body 1 are in contact with each other, and an edge 4a of the shielding film 4 is disposed inside the step 3. In other words, a portion of the edge 4a of the shielding film 4 which easily becomes a starting point of separation is located inside the step 3 so as to be protected.