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|1. (WO2018159464) CIRCUIT BOARD|
|Applicants:||MURATA MANUFACTURING CO., LTD.
This circuit board (101) is provided with a substrate (1) having a main surface (1u), a laminate (10) disposed on the main surface (1u), and an insulating layer (2) covering the main surface (1u). The laminate (10) comprises a first layer (31) mainly composed of a first metal and a second layer (32) mainly composed of a second metal, which is more likely to spread solder than the first metal, and arranged to overlap the first layer (31) from above. The insulating layer (2) is disposed so as to surround the second layer (32), while being separated from the surface of the second layer (32), when viewed from a direction perpendicular to the main surface (1u). A recess (8) is formed by the laminate (10) and the insulating layer (2) therebetween.