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1. (WO2018159464) CIRCUIT BOARD

Pub. No.:    WO/2018/159464    International Application No.:    PCT/JP2018/006571
Publication Date: Sat Sep 08 01:59:59 CEST 2018 International Filing Date: Fri Feb 23 00:59:59 CET 2018
IPC: H05K 3/34
B23K 1/00
B23K 1/14
H01L 21/60
H05K 1/09
H05K 3/28
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: HATASE, Minoru
畑瀬 稔
MIZUSHIRO, Masaaki
水白 雅章
Title: CIRCUIT BOARD
Abstract:
This circuit board (101) is provided with a substrate (1) having a main surface (1u), a laminate (10) disposed on the main surface (1u), and an insulating layer (2) covering the main surface (1u). The laminate (10) comprises a first layer (31) mainly composed of a first metal and a second layer (32) mainly composed of a second metal, which is more likely to spread solder than the first metal, and arranged to overlap the first layer (31) from above. The insulating layer (2) is disposed so as to surround the second layer (32), while being separated from the surface of the second layer (32), when viewed from a direction perpendicular to the main surface (1u). A recess (8) is formed by the laminate (10) and the insulating layer (2) therebetween.