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1. (WO2018159453) MODULE
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Pub. No.: WO/2018/159453 International Application No.: PCT/JP2018/006468
Publication Date: 07.09.2018 International Filing Date: 22.02.2018
IPC:
H01L 23/29 (2006.01) ,H01L 23/00 (2006.01) ,H01L 23/28 (2006.01) ,H01L 25/04 (2014.01) ,H01L 25/18 (2006.01) ,H05K 7/20 (2006.01) ,H05K 9/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
藤井 亮宏 FUJII, Akihiro; JP
小松 了 KOMATSU, Toru; JP
Agent:
梁瀬 右司 YANASE, Yuji; JP
丸山 陽介 MARUYAMA, Yosuke; JP
Priority Data:
2017-03711828.02.2017JP
Title (EN) MODULE
(FR) MODULE
(JA) モジュール
Abstract:
(EN) Provided is a module having excellent heat dissipation characteristics and in which the height can be easily reduced. The module 1a comprises: a wiring substrate 2; a plurality of components 3a-3c mounted on the upper surface 2a of the wiring substrate 2; a plurality of heat dissipation members 4a-4c; a sealing resin layer 5 laminated on the upper surface 2a of the wiring substrate 2; and a shield film 6 covering the surface of the sealing resin layer 5. Each of the heat dissipation members 4a-4c is formed as a sheet in which the surface is shaped as a strip. Both end sections of the heat dissipation member 4a are in contact with the upper surface 2a of the wiring substrate 2, and are in contact with components 3a and 3b disposed between the two end sections. The heat dissipation member 4a forms a heat dissipation path through which the heat given off by the component 3a is dissipated to the wiring substrate 2.
(FR) L'invention concerne un module ayant d'excellentes caractéristiques de dissipation de chaleur et dans lequel la hauteur peut être réduite facilement. Le module (1a) comprend : un substrat de câblage (2) ; une pluralité de composants (3a-3c) montés sur la surface supérieure (2a) du substrat de câblage (2) ; une pluralité d'éléments de dissipation de chaleur (4a-4c) ; une couche de résine d'étanchéité (5) stratifiée sur la surface supérieure (2a) du substrat de câblage (2) ; et un film de blindage (6) recouvrant la surface de la couche de résine d'étanchéité (5). Chacun des éléments de dissipation de chaleur (4a-4c) est de la forme d'une feuille dans laquelle la surface est de la forme d'une bande. Les deux sections d'extrémité de l'élément de dissipation de chaleur (4a) sont en contact avec la surface supérieure (2a) du substrat de câblage (2), et sont en contact avec des composants (3a et 3b) disposés entre les deux sections d'extrémité. L'élément de dissipation de chaleur (4a) forme un trajet de dissipation de chaleur par lequel la chaleur dégagée par le composant (3a) est dissipée vers le substrat de câblage (2).
(JA) 放熱特性に優れ、かつ、低背化が容易なモジュールを提供する。 モジュール1aは、配線基板2と、該配線基板2の上面2aに実装された複数の部品3a~3cと、複数の放熱部材4a~4cと、配線基板2の上面2aに積層された封止樹脂層5と、封止樹脂層5の表面を被覆するシールド膜6とを備える。ここで、放熱部材4aは、いずれも面形状が帯状をなすシート状に形成される。また、放熱部材4aの両端部は配線基板2の上面2aに接触するとともに、当該両端部の間に配置された部品3aおよび部品3bに接触し、放熱部材4aにより部品3aから発生した熱を配線基板2に放熱する放熱経路が形成される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)