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1. (WO2018159418) ADHESIVE TAPE OF USE IN PROCESSING OF SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/159418    International Application No.:    PCT/JP2018/006282
Publication Date: Sat Sep 08 01:59:59 CEST 2018 International Filing Date: Thu Feb 22 00:59:59 CET 2018
IPC: H01L 21/301
H01L 21/56
Applicants: SUMITOMO BAKELITE CO., LTD.
住友ベークライト株式会社
Inventors: NAGAO, Yoshinori
長尾 佳典
Title: ADHESIVE TAPE OF USE IN PROCESSING OF SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Abstract:
According to the present invention, an adhesive tape for use in the processing of a semiconductor substrate is provided, which comprises a base member and an adhesive layer laminated on one surface of the base member, and which can be used in such a manner that a sealed semiconductor connected body comprising a substrate, multiple semiconductor elements arranged on the substrate and a sealing part for sealing the multiple semiconductor elements is temporarily fixed onto the base member with the adhesive layer interposed therebetween when the sealed semiconductor connected body is cut in the thickness direction to produce multiple semiconductor sealed bodies. The adhesive tape for use in the processing of a semiconductor substrate is characterized in that the adhesive layer contains a release agent for reducing the adhesion of the adhesive layer to the sealing part upon the removal of the semiconductor sealed bodies from the adhesive tape for use in the processing of a semiconductor substrate, the sealing part is made from a sealing material containing an epoxy-group-containing compound, the epoxy-group-containing compound has a double bond in the molecular structure thereof, and the release agent is a silicone-type oil or a fluorine-containing surfactant.