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1. (WO2018159342) SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

Pub. No.:    WO/2018/159342    International Application No.:    PCT/JP2018/005649
Publication Date: Sat Sep 08 01:59:59 CEST 2018 International Filing Date: Tue Feb 20 00:59:59 CET 2018
IPC: H04N 5/378
H04N 5/347
H04N 5/3745
Applicants: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
ソニーセミコンダクタソリューションズ株式会社
Inventors: ENOKI Koji
榎 弘二
Title: SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Abstract:
The present feature relates to a solid-state imaging device and an electronic apparatus with which it is possible to shorten the processing time of AD conversion and perform a read at a faster speed. Provided is a solid-state imaging device comprising a pixel array unit in which pixels having a photoelectric conversion unit are two-dimensionally arranged in matrix form and a column signal line is wired for each column of the matrix arrangement of the pixels, and an AD conversion unit that converts signals outputted via the column signal line. Due to the fact that a charge-voltage conversion unit is shared for the photoelectric conversion units of a plurality of pixels, pixel sharing in units of a prescribed number of pixels is performed, and when a digital signal corresponding to the first charge of a first pixel that constitutes, together with a second pixel, the shared pixels to be subjected to AD-conversion becomes definitive in the AD conversion unit, the first charge from the first pixel and a second charge from the second pixel are added by the charge-voltage conversion unit of the shared pixels. The present feature can be applied to, for example, a column AD-type CMOS image sensor using correlated double sampling (CDS).