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1. (WO2018158945) LOUDSPEAKER SYSTEM
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Pub. No.: WO/2018/158945 International Application No.: PCT/JP2017/008556
Publication Date: 07.09.2018 International Filing Date: 03.03.2017
IPC:
H04R 1/02 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
R
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1
Details of transducers
02
Casings; Cabinets; Mountings therein
Applicants:
三菱電機エンジニアリング株式会社 MITSUBISHI ELECTRIC ENGINEERING COMPANY,LIMITED [JP/JP]; 東京都千代田区九段北一丁目13番5号 1-13-5, Kudankita, Chiyoda-ku, Tokyo 1020073, JP
Inventors:
森 清文 MORI, Kiyofumi; JP
Agent:
田澤 英昭 TAZAWA, Hideaki; JP
濱田 初音 HAMADA, Hatsune; JP
中島 成 NAKASHIMA, Nari; JP
坂元 辰哉 SAKAMOTO, Tatsuya; JP
辻岡 将昭 TSUJIOKA, Masaaki; JP
井上 和真 INOUE, Kazuma; JP
Priority Data:
Title (EN) LOUDSPEAKER SYSTEM
(FR) SYSTÈME DE HAUT-PARLEUR
(JA) スピーカシステム
Abstract:
(EN) This loudspeaker system is provided with: a housing (1a) formed vertically long; a loudspeaker unit (2a) that is provided to the front surface of the housing (1a); a port (3a) that is provided in the top surface of the housing (1a); and a port (5a) that is provided in the bottom surface of the housing (1a).
(FR) Ce système de haut-parleur est pourvu de : un boîtier (1a) formé avec un allongement vertical ; une unité de haut-parleur (2a) qui est disposée sur la surface avant du boîtier (1a) ; un orifice (3a) qui est disposé dans la surface supérieure du boîtier (1a) ; et un orifice (5a) qui est disposé dans la surface inférieure du boîtier (1a).
(JA) 縦長長尺に構成された筐体(1a)と、筐体(1a)の前面に設けられたスピーカユニット(2a)と、筐体(1a)の天面に設けられたポート(3a)と、筐体(1a)の底面に設けられたポート(5a)とを備えた。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)