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1. (WO2018158613) STACKED MICROFLUIDIC COOLED 3D ELECTRONIC-PHOTONIC INTEGRATED CIRCUIT

Pub. No.:    WO/2018/158613    International Application No.:    PCT/IB2017/051198
Publication Date: Sat Sep 08 01:59:59 CEST 2018 International Filing Date: Thu Mar 02 00:59:59 CET 2017
IPC: H01L 23/473
H01L 25/065
Applicants: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
Inventors: LIU, Neng
BRUNNER, Robert
LESSARD, Stephane
Title: STACKED MICROFLUIDIC COOLED 3D ELECTRONIC-PHOTONIC INTEGRATED CIRCUIT
Abstract:
An electronic-photonic integrated-circuit assembly comprises a carrier substrate (310) and one or more integrated-circuit dies (330, 340) bonded to one another so as to form a die stack with exterior surfaces corresponding to an outer surface of a first one of the integrated-circuit dies and to an outer surface of a second one of the integrated-circuit dies, where at least one of the integrated- circuit dies includes one or more integrated photonic devices. One or more channels or passages (320) are formed into the outer surface of the first one of the integrated-circuit dies,, and a first surface of the carrier substrate (310) is bonded to the outer surface of the first one of the integrated-circuit dies, thereby enclosing the one or more channels or passages (320), The integrated-circuit dies are electrically connected to each other via electrically conductive through- wafer interconnects or electrically conductive through-wafer vias.