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1. (WO2018157937) METHOD AND DEVICE FOR BONDING CHIPS
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Pub. No.: WO/2018/157937 International Application No.: PCT/EP2017/054971
Publication Date: 07.09.2018 International Filing Date: 02.03.2017
Chapter 2 Demand Filed: 21.11.2018
IPC:
H01L 21/683 (2006.01) ,H01L 21/67 (2006.01) ,H01L 21/78 (2006.01) ,H01L 21/60 (2006.01) ,H01L 23/544 (2006.01)
[IPC code unknown for H01L 21/683][IPC code unknown for H01L 21/67][IPC code unknown for H01L 21/78][IPC code unknown for H01L 21/60][IPC code unknown for H01L 23/544]
Applicants:
EV GROUP E. THALLNER GMBH [AT/AT]; DI Erich Thallner Str. 1 St. Florian am Inn, AT
Inventors:
WIMPLINGER, Markus; AT
Agent:
SCHNEIDER, Sascha; DE
SCHWEIGER, Johannes; DE
DR. BECKER, Thomas U.; DE
DR. MÜLLER, Karl-Ernst; DE
BERKENBRINK, Kai; DE
FEUCKER, Max; DE
Priority Data:
Title (EN) METHOD AND DEVICE FOR BONDING CHIPS
(FR) PROCÉDÉ ET DISPOSITIF D’ASSEMBLAGE DE PUCES
(DE) VERFAHREN UND VORRICHTUNG ZUM BONDEN VON CHIPS
Abstract:
(EN) The invention relates to a method for bonding chips (7) to a substrate (11') or to further chips, characterized in that the chips (7) are bonded by a direct bond to the substrate (11') or to the further chips.
(FR) L'invention concerne un procédé d’assemblage de puces (7) sur un substrat (11’) ou sur d'autres puces, caractérisé en ce que les puces (7) sont assemblées par une liaison directe sur le substrat (11') ou sur les autres puces.
(DE) Es wird ein Verfahren zum Bonden von Chips (7) auf ein Substrat (11') oder auf weitere Chips vorgeschlagen, dadurch gekennzeichnet, dass die Chips (7) durch einen Direktbond auf das Substrat (11') oder die weiteren Chips gebondet werden.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)