Search International and National Patent Collections

1. (WO2018157780) CHIP BONDING DEVICE

Pub. No.:    WO/2018/157780    International Application No.:    PCT/CN2018/077348
Publication Date: Sat Sep 08 01:59:59 CEST 2018 International Filing Date: Wed Feb 28 00:59:59 CET 2018
IPC: H01L 21/67
H01L 21/66
H01L 21/60
Applicants: SHANGHAI MICRO ELECTRONICS EQUIPMENT(GROUP) CO., LTD.
上海微电子装备(集团)股份有限公司
Inventors: CHEN, Feibiao
陈飞彪
XIA, Hai
夏海
ZHU, Yuebin
朱岳彬
CHENG, Hailin
程海林
JIANG, Xiaoyu
姜晓玉
ZHAO, Lili
赵丽丽
ZHANG, Donghao
张东浩
Title: CHIP BONDING DEVICE
Abstract:
A chip bonding apparatus includes a chip separating unit (100), a chip aligning unit (400), a chip bonding unit (300) and a bonding hand unit. The bonding key unit comprises a first bonding hand unit (200) and a second bonding hand unit (500), the first bonding hand unit including a first moving table (210), a first driving device (230) for driving the first moving table, at least one first bonding hand (220) disposed on the first moving table, the first bonding hand being used to extract a chip from the chip separating unit to transmit the same to the chip aligning unit; the second bonding hand unit comprising a second moving table (510), a second driving device (530) for driving the second moving table, and at least one second bonding hand (520) provided on the second moving table, the second bonding hand being used to extract a chip from the chip aligning unit to transmit the same to the chip bonding unit. The chip bonding device realizes synchronization work of chip transmission, chip alignment and chip bonding and improves yield.