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|1. (WO2018157780) CHIP BONDING DEVICE|
|Applicants:||SHANGHAI MICRO ELECTRONICS EQUIPMENT(GROUP) CO., LTD.
|Title:||CHIP BONDING DEVICE|
A chip bonding apparatus includes a chip separating unit (100), a chip aligning unit (400), a chip bonding unit (300) and a bonding hand unit. The bonding key unit comprises a first bonding hand unit (200) and a second bonding hand unit (500), the first bonding hand unit including a first moving table (210), a first driving device (230) for driving the first moving table, at least one first bonding hand (220) disposed on the first moving table, the first bonding hand being used to extract a chip from the chip separating unit to transmit the same to the chip aligning unit; the second bonding hand unit comprising a second moving table (510), a second driving device (530) for driving the second moving table, and at least one second bonding hand (520) provided on the second moving table, the second bonding hand being used to extract a chip from the chip aligning unit to transmit the same to the chip bonding unit. The chip bonding device realizes synchronization work of chip transmission, chip alignment and chip bonding and improves yield.