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1. (WO2018157528) SOUNDER MODULE

Pub. No.:    WO/2018/157528    International Application No.:    PCT/CN2017/090637
Publication Date: Sat Sep 08 01:59:59 CEST 2018 International Filing Date: Thu Jun 29 01:59:59 CEST 2017
IPC: H04R 1/04
Applicants: GOERTEK. INC
歌尔股份有限公司
Inventors: CHEN, Aliang
陈阿亮
LIU, Guangfu
刘广福
CHEN, Guoqiang
陈国强
Title: SOUNDER MODULE
Abstract:
Disclosed in the present invention is a sounder module. The sounder module comprises a modular housing and a circuit board provided in the modular housing. The modular housing has a through-plate opening, and the circuit board extends to the outside of the modular housing through the through-plate opening. The modular housing has a first glue injection hole and a second glue injection hole which are positioned near the through-plate opening. The first glue injection hole and the second glue rejection hole respectively extend to both side surfaces of the circuit board from the outside of the modular housing. The first glue injection hole and the second glue injection hole communicate at the circuit board. The first glue injection hole and the second glue injection hole are filled with sealing glue. The sealing glue is configured to seal the gap between the circuit board and the through-plate opening and seal the first glue injection hole and the second glue injection hole. A technical problem solved by the present invention is how to improve the sealing status between the circuit board and the through-plate opening.