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|1. (WO2018157314) PHOTOELECTRIC HYBRID PACKAGE ASSEMBLY|
|Applicants:||HUAWEI TECHNOLOGIES CO., LTD.
|Title:||PHOTOELECTRIC HYBRID PACKAGE ASSEMBLY|
The present application provides a photoelectric hybrid package assembly comprising: a mother PCB board; a first daughter PCB board disposed on one side of the mother PCB board; an optical chip disposed on one side of the first daughter PCB board; and an electric chip disposed on the other side of the first daughter PCB board. The photoelectric hybrid package assembly provided by the present application effectively improves stability and reliability of the operation of the optical chip and the electric chip on the basis of ensuring high integration of the device.