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1. (WO2018157314) PHOTOELECTRIC HYBRID PACKAGE ASSEMBLY

Pub. No.:    WO/2018/157314    International Application No.:    PCT/CN2017/075270
Publication Date: Sat Sep 08 01:59:59 CEST 2018 International Filing Date: Wed Mar 01 00:59:59 CET 2017
IPC: H01L 25/00
Applicants: HUAWEI TECHNOLOGIES CO., LTD.
华为技术有限公司
Inventors: GAO, Lei
高磊
ZENG, Li
曾理
SONG, Xiaolu
宋小鹿
DONG, Zhen
董振
Title: PHOTOELECTRIC HYBRID PACKAGE ASSEMBLY
Abstract:
The present application provides a photoelectric hybrid package assembly comprising: a mother PCB board; a first daughter PCB board disposed on one side of the mother PCB board; an optical chip disposed on one side of the first daughter PCB board; and an electric chip disposed on the other side of the first daughter PCB board. The photoelectric hybrid package assembly provided by the present application effectively improves stability and reliability of the operation of the optical chip and the electric chip on the basis of ensuring high integration of the device.