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1. (WO2018155382) RFID TAG
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Pub. No.: WO/2018/155382 International Application No.: PCT/JP2018/005754
Publication Date: 30.08.2018 International Filing Date: 19.02.2018
IPC:
G06K 19/077 (2006.01) ,H01L 23/32 (2006.01) ,H01Q 1/38 (2006.01) ,H01Q 1/50 (2006.01) ,H01Q 9/26 (2006.01) ,H05K 1/02 (2006.01) ,H05K 1/11 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
077
Constructional details, e.g. mounting of circuits in the carrier
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
32
Holders for supporting the complete device in operation, i.e. detachable fixtures
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
36
Structural form of radiating elements, e.g. cone, spiral, umbrella
38
formed by a conductive layer on an insulating support
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
50
Structural association of aerials with earthing switches, lead-in devices, or lightning protectors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
9
Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
04
Resonant aerials
16
with feed intermediate between the extremities of the aerial, e.g. centre-fed dipole
26
with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
加藤 登 KATO, Noboru; JP
Agent:
鮫島 睦 SAMEJIMA, Mutsumi; JP
岡部 博史 OKABE, Hiroshi; JP
Priority Data:
2017-03027921.02.2017JP
Title (EN) RFID TAG
(FR) ETIQUETTE RFID
(JA) RFIDタグ
Abstract:
(EN) This RFID tag 10 comprises: an RFIC module 14 which is provided with a base substrate 22 and an RFIC chip 24; and an antenna element 16. A main surface 22a of the base substrate is provided with: a first terminal 26a for chip connection, which is connected to a first input/output terminal 24a of the RFIC chip; a second terminal 26b for chip connection, which is connected to a second input/output terminal 24b; a first module-side terminal 26c which is galvanically connected or capacitively coupled to a first antenna-side terminal 18a of the antenna element; a second module-side terminal 26d which is galvanically connected or capacitively coupled to a second antenna-side terminal 20a; a first wiring pattern 26e which connects the first terminal for chip connection and the first module-side terminal to each other; a second wiring pattern 26f which connects the second terminal for chip connection and the second module-side terminal to each other; and a third wiring pattern 26g which connects the first module-side terminal and the second module-side terminal to each other.
(FR) L’invention concerne une étiquette RFID qui comprend : un module RFIC (14) qui est pourvu d'un substrat de base (22) et d'une puce RFIC (24); et un élément antenne (16). Une surface principale (22a) du substrat de base est pourvue : d'un premier terminal (26a) de connexion de puce, qui est connecté à un premier terminal d'entrée/sortie (24a) de la puce RFIC ; d'un second terminal (26b) de connexion de puce, qui est connecté à un deuxième terminal d'entrée/sortie (24b) ; d'un premier terminal côté module (26c) qui est connecté galvaniquement ou couplé de manière capacitive à un premier terminal côté antenne (18a) de l'élément antenne ; d'un second terminal côté module (26d) qui est connecté galvaniquement ou couplé de manière capacitive à un second terminal côté antenne (20a) ; d'un premier motif de câblage (26e) qui connecte le premier terminal de connexion de puce et le premier terminal côté module l'un à l'autre ; d'un second motif de câblage (26f) qui connecte le second terminal de connexion de puce et le second terminal côté module l'un à l'autre ; et un troisième motif de câblage (26g) qui connecte le premier côté module et le second terminal côté module l'un à l'autre.
(JA) RFIDタグ10は、ベース基材22とRFICチップ24とを備えるRFICモジュール14及びアンテナ素子16を有する。ベース基材の主面22aに、RFICチップの第1の入出力端子24aと接続する第1のチップ接続用端子26a、第2の入出力端子24bと接続する第2のチップ接続用端子26b、アンテナ素子の第1のアンテナ側端子18aと直流的に接続するまたは容量結合する第1のモジュール側端子26c、第2のアンテナ側端子20aと直流的に接続するまたは容量結合する第2のモジュール側端子26d、第1のチップ接続用端子と第1のモジュール側端子とを接続する第1の配線パターン26e、第2のチップ接続用端子と第2のモジュール側端子とを接続する第2の配線パターン26f、及び第1のモジュール側端子と第2のモジュール側端子とを接続する第3の配線パターン26gが設けられている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)