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1. WO2018155137 - PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Publication Number WO/2018/155137
Publication Date 30.08.2018
International Application No. PCT/JP2018/003652
International Filing Date 02.02.2018
IPC
H05K 3/46 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
B32B 15/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
B32B 27/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
B32B 27/38 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
38comprising epoxy resins
CPC
B32B 15/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is next to another layer of the same or of a different material
08of synthetic resin
B32B 27/00
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
B32B 27/38
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
38comprising epoxy resins
H05K 1/05
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
05Insulated ; conductive substrates, e.g. insulated; metal substrate
H05K 2201/0141
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0137Materials
0141Liquid crystal polymer [LCP]
H05K 2201/0175
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0137Materials
0175Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
Applicants
  • パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP]/[JP]
Inventors
  • ▲高▼橋 広明 TAKAHASHI, Hiroaki
  • 小山 雅也 KOYAMA, Masaya
  • 古森 清孝 KOMORI, Kiyotaka
  • 田代 浩 TASHIRO, Yutaka
  • 森川 宏樹 MORIKAWA, Hiroki
Agents
  • 特許業務法人北斗特許事務所 HOKUTO PATENT ATTORNEYS OFFICE
Priority Data
2017-03255823.02.2017JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
(FR) CARTE DE CIRCUIT IMPRIMÉ ET PROCÉDÉ DE FABRICATION D’UNE CARTE DE CIRCUIT IMPRIMÉ
(JA) プリント配線板及びプリント配線板の製造方法
Abstract
(EN)
The purpose of the present invention is to provide: a printed wiring board that is provided with an insulating layer made from a liquid crystal polymer and that can suppress peeling of the insulating layer when heated; and a method for manufacturing the printed wiring board. This printed wiring board (1) is provided with: a first insulating layer (21) equipped with a first surface (41) and a second surface (42) on the opposite side of the first surface (41); a second insulating layer (22) overlapping the first surface (41) of the first insulating layer (21); and a conductor wiring (3) interposed between the first insulating layer (21) and the second insulating layer (22). The first insulating layer (21) contains a liquid crystal polymer. The second insulating layer (22) contains: a cured product of a thermosetting composition that contains an inorganic filler and a thermosetting component; and a fibrous base material. The temperature for reaching a mass reduction of 5% with respect to an initial state when the temperature of the second insulation layer (22) is increased at a heating speed of 10°C/min from the initial state of 25°C, is 355°C or greater.
(FR)
L'objet de la présente invention est de fournir : une carte de circuit imprimé qui est pourvue d'une couche isolante constituée d'un polymère à cristaux liquides et qui peut supprimer le pelage de la couche isolante lorsqu'elle est chauffée ; et un procédé de fabrication de la carte de circuit imprimé. Cette carte de circuit imprimé (1) est pourvue : d'une première couche isolante (21) équipée d'une première surface (41) et d'une seconde surface (42) sur le côté opposé de la première surface (41) ; d'une seconde couche isolante (22) chevauchant la première surface (41) de la première couche isolante (21) ; et d'un câblage conducteur (3) intercalé entre la première couche isolante (21) et la seconde couche isolante (22). La première couche isolante (21) contient un polymère à cristaux liquides. La seconde couche isolante (22) contient : un produit durci d'une composition thermodurcissable qui contient une charge inorganique et un composant thermodurcissable ; et un matériau de base fibreux. La température pour atteindre une réduction de masse de 5 % par rapport à un état initial lorsque la température de la seconde couche isolante (22) est augmentée à une vitesse de chauffage de 10 °C/minute à partir de l'état initial de 25 °C, est supérieure ou égale à 355 °C.
(JA)
本発明の目的は、液晶ポリマーから作製された絶縁層を備え、加熱された場合の絶縁層の剥離を抑制することができるプリント配線板及びその製造方法を提供することである。プリント配線板(1)は、第一面(41)及び第一面(41)とは反対側の第二面(42)を備える第一絶縁層(21)と、第一絶縁層(21)の第一面(41)に重なっている第二絶縁層(22)と、第一絶縁層(21)と第二絶縁層(22)との間に介在する導体配線(3)とを備える。第一絶縁層(21)は、液晶ポリマーを含有し、第二絶縁層(22)は、無機充填材と熱硬化性成分とを含有する熱硬化性組成物の硬化物と繊維質基材とを含有する。第二絶縁層(22)は、25℃の初期状態から昇温速度10℃/minで昇温させた場合の、初期状態に対する質量減少が5%に達する温度が、355℃以上である。
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Latest bibliographic data on file with the International Bureau