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1. WO2018154764 - SUBSTRATE MOUNTING STAGE, INKJET COATING DEVICE, LEVELING DEVICE, AND METHOD FOR MANUFACTURING ORGANIC EL DISPLAY DEVICE

Publication Number WO/2018/154764
Publication Date 30.08.2018
International Application No. PCT/JP2017/007401
International Filing Date 27.02.2017
IPC
H05B 33/10 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
B05C 5/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
5Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 13/02 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
13Means for manipulating or holding work, e.g. for separate articles
02for particular articles
G09F 9/30 2006.1
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
H01L 27/32 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/50 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
CPC
H01L 21/6715
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
6715Apparatus for applying a liquid, a resin, an ink or the like
H01L 27/3246
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3246Pixel defining structures, e.g. banks
H01L 51/0005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0003using liquid deposition, e.g. spin coating
0004using printing techniques, e.g. ink-jet printing, screen printing
0005ink-jet printing
H01L 51/0026
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0026Thermal treatment of the active layer, e.g. annealing
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • シャープ株式会社 SHARP KABUSHIKI KAISHA [JP]/[JP]
Inventors
  • 高橋 純平 TAKAHASHI, Jumpei
  • 平瀬 剛 HIRASE, Takeshi
  • 越智 久雄 OCHI, Hisao
  • 越智 貴志 OCHI, Takashi
  • 妹尾 亨 SENOO, Tohru
  • 園田 通 SONODA, Tohru
  • 松井 章宏 MATSUI, Akihiro
  • 宮本 恵信 MIYAMOTO, Yoshinobu
Agents
  • 特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK
Priority Data
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE MOUNTING STAGE, INKJET COATING DEVICE, LEVELING DEVICE, AND METHOD FOR MANUFACTURING ORGANIC EL DISPLAY DEVICE
(FR) ÉTAGE DE MONTAGE DE SUBSTRAT, DISPOSITIF DE REVÊTEMENT À JET D'ENCRE, DISPOSITIF DE NIVELLEMENT ET PROCÉDÉ DE FABRICATION DE DISPOSITIF D'AFFICHAGE ÉLECTROLUMINESCENT ORGANIQUE
(JA) 基板搭載ステージ、インクジェット塗布装置、レベリング装置および有機EL表示装置の製造方法
Abstract
(EN) The present invention is characterized in that a substrate mounting part (30) has, at a position that corresponds to a frame-shaped bank (4) surrounding a pixel formation region (3) of a substrate (1), a low temperature part (34) which is adjusted to the ambient temperature or lower. As a result, the width of an edge of a sealing layer is reduced.
(FR) La présente invention est caractérisée en ce qu'une partie de montage de substrat (30) a, à une position qui correspond à une banque en forme de cadre (4) entourant une région de formation de pixels (3) d'un substrat (1), une partie basse température (34) qui est ajustée à une température inférieure ou égale à la température ambiante. Par conséquent, la largeur d'un bord d'une couche d'étanchéité est réduite.
(JA) 基板搭載部30は、基板(1)の画素形成領域(3)を囲む枠状バンク(4)に対応する位置に、雰囲気温度以下に調整された低温部(34)を有することを特徴とする。これにより、封止層の縁の幅を狭める。
Related patent documents
JP2019500991This application is not viewable in PATENTSCOPE because the national phase entry has not been published yet or the national entry is issued from a country that does not share data with WIPO or there is a formatting issue or an unavailability of the application.
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