WO2018152647 WIREBONDING FOR SIDE-PACKAGED OPTICAL ENGINE

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Publication Number WO/2018/152647

Publication Date 30.08.2018

International Application No. PCT/CA2018/050219

International Filing Date 26.02.2018

IPC

CPC

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Applicants

REFLEX PHOTONICS INC. [CA]/[CA]

Inventors

ROLSTON, David Robert Cameron

Agents

NORTON ROSE FULBRIGHT CANADA LLP S.E.N.C.R.L., S.R.L.

Priority Data

62/463,347

24.02.2017

Publication Language English (en)

Filing Language English (EN)

Designated States

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Title

(EN) WIREBONDING FOR SIDE-PACKAGED OPTICAL ENGINE

(FR) MICROCÂBLAGE POUR MOTEUR OPTIQUE À BOÎTIER LATÉRAL

Abstract

(EN) The present disclosure is drawn to wirebonding for optical engines having side-mounted optoelectronic components. An integrated circuit is mounted on a first surface of a substrate block, and an optoelectronic component is positioned on a second surface of the substrate block and is oriented to emit light in a direction parallel to a plane defined by the first surface. A wirebond is drawn between the integrated circuit and a base substrate on which the substrate block is mounted. A optoelectronic component is then contacted with the wirebond, and a portion of the wirebond between the optoelectronic component and the base substrate is removed.

(FR) La présente invention se rapporte à un microcablâge pour des moteurs optiques ayant des composants optoélectroniques montés latéralement. Un circuit intégré est monté sur une première surface d'un bloc de substrat, et un composant optoélectronique est positionné sur une seconde surface du bloc de substrat et est orienté pour émettre de la lumière dans une direction parallèle à un plan défini par la première surface. Un microcâblage est établi entre le circuit intégré et un substrat de base sur lequel le bloc de substrat est monté. Un composant optoélectronique est ensuite mis en contact avec le microcâblage, et une partie du microcâblage entre le composant optoélectronique et le substrat de base est retirée.

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50	Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60	Attaching leads or other conductive members, to be used for carrying current to or from the device in operation

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33	Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48	characterised by the semiconductor body packages
62	Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50	Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60	Attaching leads or other conductive members, to be used for carrying current to or from the device in operation

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33	Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48	characterised by the semiconductor body packages
62	Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

G	PHYSICS
02	OPTICS
B	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6	Light guides
24	Coupling light guides
36	Mechanical coupling means
38	having fibre to fibre mating means
3807	Dismountable connectors, i.e. comprising plugs
3873	Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
3885	Multicore or multichannel optical connectors, i.e. one single ferrule containing more than one fibre, e.g. ribbon type

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1. WO2018152647 - WIREBONDING FOR SIDE-PACKAGED OPTICAL ENGINE

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
K	ELECTRIC INCANDESCENT LAMPS
5	Lamps for general lighting

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224	Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42	Wire connectors; Manufacturing methods related thereto
47	Structure, shape, material or disposition of the wire connectors after the connecting process
48	of an individual wire connector
4805	Shape
4809	Loop shape

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24	Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02	Bonding areas
04	Structure, shape, material or disposition of the bonding areas prior to the connecting process
06	of a plurality of bonding areas