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1. WO2018152647 - WIREBONDING FOR SIDE-PACKAGED OPTICAL ENGINE

Publication Number WO/2018/152647
Publication Date 30.08.2018
International Application No. PCT/CA2018/050219
International Filing Date 26.02.2018
IPC
H01L 21/60 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 33/62 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
CPC
G02B 6/3885
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
36Mechanical coupling means
38having fibre to fibre mating means
3807Dismountable connectors, i.e. comprising plugs
3873Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
3885Multicore or multichannel optical connectors, i.e. one single ferrule containing more than one fibre, e.g. ribbon type
G02B 6/4249
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4249comprising arrays of active devices and fibres
G02B 6/4274
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4274Electrical aspects
G02B 6/428
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4274Electrical aspects
428containing printed circuit boards [PCB]
G02B 6/4292
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4292the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
H01K 5/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
KELECTRIC INCANDESCENT LAMPS
5Lamps for general lighting
Applicants
  • REFLEX PHOTONICS INC. [CA]/[CA]
Inventors
  • ROLSTON, David Robert Cameron
Agents
  • NORTON ROSE FULBRIGHT CANADA LLP S.E.N.C.R.L., S.R.L.
Priority Data
62/463,34724.02.2017US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) WIREBONDING FOR SIDE-PACKAGED OPTICAL ENGINE
(FR) MICROCÂBLAGE POUR MOTEUR OPTIQUE À BOÎTIER LATÉRAL
Abstract
(EN) The present disclosure is drawn to wirebonding for optical engines having side-mounted optoelectronic components. An integrated circuit is mounted on a first surface of a substrate block, and an optoelectronic component is positioned on a second surface of the substrate block and is oriented to emit light in a direction parallel to a plane defined by the first surface. A wirebond is drawn between the integrated circuit and a base substrate on which the substrate block is mounted. A optoelectronic component is then contacted with the wirebond, and a portion of the wirebond between the optoelectronic component and the base substrate is removed.
(FR) La présente invention se rapporte à un microcablâge pour des moteurs optiques ayant des composants optoélectroniques montés latéralement. Un circuit intégré est monté sur une première surface d'un bloc de substrat, et un composant optoélectronique est positionné sur une seconde surface du bloc de substrat et est orienté pour émettre de la lumière dans une direction parallèle à un plan défini par la première surface. Un microcâblage est établi entre le circuit intégré et un substrat de base sur lequel le bloc de substrat est monté. Un composant optoélectronique est ensuite mis en contact avec le microcâblage, et une partie du microcâblage entre le composant optoélectronique et le substrat de base est retirée.
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