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1. WO2018149724 - METHOD FOR PRODUCING A CONVERSION DEVICE COMPRISING A CONVERSION ELEMENT AND A SCATTERING MATERIAL COATING

Publication Number WO/2018/149724
Publication Date 23.08.2018
International Application No. PCT/EP2018/053151
International Filing Date 08.02.2018
IPC
H01L 33/00 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H01L 33/50 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
H01L 33/48 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H01L 33/58 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
58Optical field-shaping elements
CPC
H01L 2933/0041
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0033relating to semiconductor body packages
0041relating to wavelength conversion elements
H01L 2933/0091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0091Scattering means in or on the semiconductor body or semiconductor body package
H01L 33/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
H01L 33/58
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
58Optical field-shaping elements
Applicants
  • OSRAM OPTO SEMICONDUCTORS GMBH [DE]/[DE]
Inventors
  • BRANDL, Martin
Agents
  • PATENTANWALTSKANZLEI WILHELM & BECK
Priority Data
10 2017 103 328.917.02.2017DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUM HERSTELLEN EINER KONVERSIONSVORRICHTUNG MIT EINEM KONVERSIONSELEMENT UND EINER STREUMATERIALBESCHICHTUNG
(EN) METHOD FOR PRODUCING A CONVERSION DEVICE COMPRISING A CONVERSION ELEMENT AND A SCATTERING MATERIAL COATING
(FR) PROCÉDÉ POUR LA FABRICATION D'UN DISPOSITIF DE CONVERSION COMPRENANT UN ÉLÉMENT DE CONVERSION ET UNE COUCHE DE MATÉRIAU DE DISPERSION
Abstract
(DE)
Die Erfindung betrifft ein Verfahren zum Herstellen einer Konversionsvorrichtung (6) mit einem Konversionselement (1) mit einer Streumaterialbeschichtung (13); wobei auf einer Oberseite eines Trägers (2) mehrere Konversionselemente (1) nebeneinander mit Zwischenräumen zwischen den Konversionselementen (1) aufgebracht werden, wobei die Konversionselemente (1) ausgebildet sind, um elektromagnetische Strahlung in der Wellenlänge zu verschieben; wobei Oberseiten (14) der Konversionselemente (1) und Zwischenräume zwischen den Konversionselementen (1) mit dem Streumaterial (3) aufgefüllt werden, so dass die Konversionselemente (1) in eine Streuschicht (12) eingebettet sind; wobei anschließend Gräben (4) in die Streuschicht (12) im Bereich der Zwischenräume beabstandet von Seitenflächen der Konversionselemente (1) eingebracht werden, wobei die Gräben (4) von einer Oberseite der Streuschicht (12) bis zu einer Oberseite des Trägers (2) ausgebildet werden, und wobei die Gräben (4) wenigstens ein Konversionselement (1) mit einer Streumaterialbeschichtung (13) umgeben; und wobei anschließend die Konversionselemente (1) mit der Streumaterialbeschichtung (13) als Konversionsvorrichtung (6) vom Träger (2) gelöst werden.
(EN)
The invention relates to a method for producing a conversion device (6) comprising a conversion element (1) with a scattering material coating (13); wherein on a top side of a carrier (2) a plurality of conversion elements (1) are applied alongside one another with interspaces between the conversion elements (1), wherein the conversion elements (1) are configured to shift the wavelength of electromagnetic radiation; wherein top sides (14) of the conversion elements (1) and interspaces between the conversion elements (1) are filled with the scattering material (3), such that the conversion elements (1) are embedded into a scattering layer (12); wherein trenches (4) are subsequently introduced into the scattering layer (12) in the region of the interspaces at a distance from side faces of the conversion elements (1), wherein the trenches (4) are formed from a top side of the scattering layer (12) as far as a top side of the carrier (2), and wherein the trenches (4) surround at least one conversion element (1) with a scattering material coating (13); and wherein the conversion elements (1) with the scattering material coating (13) as conversion device (6) are subsequently detached from the carrier (2).
(FR)
L’invention concerne un procédé pour la fabrication d’un dispositif de conversion (6) comprenant un élément de conversion (1) ayant une couche de matériau de dispersion (13) ; plusieurs éléments de conversion (1) étant disposés côte à côte sur une face supérieure d’un support (2) avec des espaces entre les éléments de conversion (1), les éléments de conversion étant conçus pour décaler la longueur d’onde d'un rayonnement électromagnétique ; les faces supérieures (14) des éléments de conversion (1) et les espaces intermédiaires entre les éléments de conversion (1) étant remplis avec le matériau de dispersion (3), de sorte que les éléments de conversion (1) soient encastrés dans une couche de dispersion (12) ; dans la zone des espaces intermédiaires, des tranchées (4) sont ensuite formées dans la couche de dispersion (12), espacées des faces latérales des éléments de conversion (1), les tranchées (4) étant formées depuis une face supérieure de la couche de dispersion (12) jusqu'à une face supérieure du support (2), et les tranchées (4) entourant au moins un élément de conversion (1) avec une couche de matériau de dispersion (13) ; et les éléments de conversion (1) avec la couche de matériau de dispersion (13) étant ensuite, en tant que dispositif de conversion (6), détachés du support (2).
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