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1. WO2018149622 - PROJECTION LIGHTING SYSTEM FOR SEMICONDUCTOR LITHOGRAPHY WITH AN IMPROVED HEAT TRANSFER

Publication Number WO/2018/149622
Publication Date 23.08.2018
International Application No. PCT/EP2018/052029
International Filing Date 29.01.2018
IPC
G03F 7/20 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
CPC
G03F 7/70075
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70058Mask illumination systems
70075Homogenization of illumination intensity in the mask plane, by using an integrator, e.g. fly's eye lenses, facet mirrors, glass rods, by using a diffusive optical element or by beam deflection
G03F 7/702
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70058Mask illumination systems
702Reflective illumination, i.e. reflective optical elements other than folding mirrors
G03F 7/70208
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70058Mask illumination systems
70208Multiple illumination paths, e.g. radiation distribution device, multiplexer, demultiplexer for single or multiple projection systems
G03F 7/7045
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70425Imaging strategies, e.g. for increasing throughput, printing product fields larger than the image field, compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching, double patterning
7045Hybrid exposure, i.e. combining different types of exposure, e.g. projection, proximity, direct write, interferometric, uv, x-ray, particle beam
G03F 7/70825
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70808Construction details, e.g. housing, load-lock, seals, windows for passing light in- and out of apparatus
70825Mounting of individual elements, e.g. mounts, holders or supports
G03F 7/70875
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70858Environment aspects, e.g. pressure of beam-path gas, temperature
70866of mask or workpiece
70875Temperature
Applicants
  • CARL ZEISS SMT GMBH [DE]/[DE]
Inventors
  • WEBER, Ulrich
  • ANDERL, Willi
Agents
  • RAUNECKER PATENT
Priority Data
10 2017 202 653.720.02.2017DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) PROJEKTIONSBELICHTUNGSANLAGE FÜR DIE HALBLEITERLITHOGRAPHIE MIT VERBESSERTEM WÄRMEÜBERGANG
(EN) PROJECTION LIGHTING SYSTEM FOR SEMICONDUCTOR LITHOGRAPHY WITH AN IMPROVED HEAT TRANSFER
(FR) SYSTÈME D’EXPOSITION PAR PROJECTION POUR LITHOGRAPHIE À SEMI-CONDUCTEUR À TRANSFERT DE CHALEUR AMÉLIORÉE
Abstract
(DE) Die Erfindung betrifft eine Projektionsbelichtungsanlage für die Halbleiterlithographie mit einem Verbindungselement (21) zur Verbindung einer Komponente (22) der Anlage mit einer Trag-Kühlstruktur (23), wobei das Verbindungselement (21) einen Aufnahmebereich (24) zur Aufnahme der Komponente (22) und einen Fußbereich (25) zur Verbindung des Verbindungselementes (21) mit der Trag-Kühlstruktur (23) der Projektionsbelichtungsanlage aufweist und wobei zwischen dem Aufnahmebereich (24) und dem Fußbereich (25) zumindest ein Gelenk (26) angeordnet ist, und wobei weiterhin zwischen dem Aufnahmebereich (24) und dem Fußbereich (25) zumindest ein Wärmeleitelement (27) angeordnet ist. Erfindungsgemäß ist das Wärmeleitelement (27) in Aktuierungsrichtung des Gelenkes (26) weich ausgebildet und zeigt senkrecht zur Aktuierungsrichtung des Gelenkes (26) eine Steifigkeit, die mindestens doppelt so hoch ist wie in Aktuierungsrichtung des Gelenkes (26).
(EN) The invention relates to a projection lighting system for semiconductor lithography, comprising a connection element (21) for connecting a component (22) of the system to a support cooling structure (23). The connection element (21) has a receiving region (24) for receiving the component (22) and a foot region (25) for connecting the connection element (21) to the support cooling structure (23) of the projection lighting system. At least one joint (26) is arranged between the receiving region (24) and the foot region (25), and at least one heat conductive element (27) is arranged between the receiving region (24) and the foot region (25). According to the invention, the heat conductive element (27) is soft in an actuation direction of the joint (26) and exhibits a rigidity perpendicularly to the actuation direction of the joint (26), said rigidity being at least twice as high as in the actuation direction of the joint (26).
(FR) L’invention concerne un système d’exposition par projection, destiné à la lithographie à semi-conducteur, comportant un élément de liaison (21) destiné à relier un composant (22) du système à une structure porteuse de refroidissement (23). L’élément de liaison (21) comporte une zone de réception (24) destinée à recevoir le composant (22) et une zone de pied (25) destiné à relier l’élément de liaison (21) à la structure porteuse de refroidissement (23) du système d’exposition par projection et au moins une articulation (26) est disposée entre la zone de réception (24) et la zone de pied (25) et au moins un élément conducteur de chaleur (27) est en outre disposé entre la zone de réception (24) et la zone de pied (25). Selon l’invention, l’élément conducteur de chaleur (27) est souple dans la direction d’actionnement de l’articulation (26) et présente, perpendiculairement à la direction d’actionnement de l’articulation (26), une rigidité qui est au moins deux fois plus élevée que dans la direction d’actionnement de l’articulation (26).
Related patent documents
EP2018704166This application is not viewable in PATENTSCOPE because the national phase entry has not been published yet or the national entry is issued from a country that does not share data with WIPO or there is a formatting issue or an unavailability of the application.
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