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1. (WO2018147074) POLISHING LIQUID AND POLISHING METHOD
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Pub. No.: WO/2018/147074 International Application No.: PCT/JP2018/001981
Publication Date: 16.08.2018 International Filing Date: 23.01.2018
IPC:
H01L 21/304 (2006.01) ,B24B 37/00 (2012.01) ,C09G 1/02 (2006.01) ,C09K 3/14 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
G
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
1
Polishing compositions
02
containing abrasives or grinding agents
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
14
Anti-slip materials; Abrasives
Applicants:
日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 東京都千代田区丸の内一丁目9番2号 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors:
小野 裕 ONO Hiroshi; JP
水谷 真人 MIZUTANI Makoto; JP
Agent:
長谷川 芳樹 HASEGAWA Yoshiki; JP
清水 義憲 SHIMIZU Yoshinori; JP
平野 裕之 HIRANO Hiroyuki; JP
Priority Data:
2017-02135908.02.2017JP
Title (EN) POLISHING LIQUID AND POLISHING METHOD
(FR) LIQUIDE DE POLISSAGE ET PROCÉDÉ DE POLISSAGE
(JA) 研磨液及び研磨方法
Abstract:
(EN) Provided is a polishing liquid which is used to polish a surface-to-be-polished that contains a tungsten material, wherein: the polishing liquid contains abrasive grains, a polymer having cationic groups at terminals, an oxidizing agent, a metal oxide-solubilizing agent and water; the polymer has structural units derived from an unsaturated carboxylic acid and has a weight average molecular weight of 20,000 or less; and the polishing liquid has a pH of less than 5.0.
(FR) La présente invention concerne un liquide de polissage qui est destiné à polir une surface à polir qui contient un matériau de tungstène, le liquide de polissage contenant des grains abrasifs, un polymère ayant des groupes cationiques au niveau de bornes, un agent oxydant, un agent de solubilisation d'oxyde métallique et de l'eau ; le polymère présente des motifs structuraux dérivés d'un acide carboxylique insaturé et a un poids moléculaire moyen en poids inférieur ou égal à 20 000 ; et le liquide de polissage a un pH inférieur à 5,0.
(JA) タングステン材料を含む被研磨面を研磨するための研磨液であって、砥粒と、末端にカチオン性基を有する重合体と、酸化剤と、酸化金属溶解剤と、水と、を含有し、前記重合体が、不飽和カルボン酸に由来する構造単位を有し、前記重合体の重量平均分子量が20000以下であり、pHが5.0未満である、研磨液。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)