Search International and National Patent Collections
|1. (WO2018146933) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE|
|Applicants:||FUJI ELECTRIC CO.,LTD.
|Title:||SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE|
Provided are a semiconductor device with which a change in form of an insulating circuit substrate can be suppressed and improved heat dissipation can be obtained, and a method for manufacturing the same. The semiconductor device is provided with: an insulating circuit substrate (3a, 3b, 3c) on which a semiconductor chip (7) is mounted; and a case (1a) which has bonding areas 8 for bonding to the insulating circuit substrate (3a, 3b, 3c) in each of at least a pair of side wall portions forming two sides opposing each other. Each bonding area 8 has an arched shape with the center in a direction in which the two sides extend protruding beyond the ends toward the insulating circuit substrate (3a, 3b, 3c).