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|1. (WO2018146906) SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD|
|Applicants:||SCREEN HOLDINGS CO., LTD.
|Title:||SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD|
Provided is a technique for reducing the re-adhesion of foreign substances, which have been adhered to a cup, to a substrate. The substrate processing device 1 has an upper cup part 32 having: a first cylindrical section 321 and a second cylindrical section 322 which are formed in cylindrical shapes capable of surrounding a substrate W held in a substrate holding part 10, wherein the second cylindrical section 322 is connected to an upper portion of the first cylindrical section 321. In addition, the substrate processing device 1 is provided with a cup moving part 36 which moves the upper cup part 32 in the vertical direction and thereby stops the upper cup part 32 at a position at which the first cylindrical section 321 surrounds the substrate W and a position at which the second cylindrical section 322 surrounds the substrate W.