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1. (WO2018146906) SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

Pub. No.:    WO/2018/146906    International Application No.:    PCT/JP2017/042009
Publication Date: Fri Aug 17 01:59:59 CEST 2018 International Filing Date: Thu Nov 23 00:59:59 CET 2017
IPC: H01L 21/304
Applicants: SCREEN HOLDINGS CO., LTD.
株式会社SCREENホールディングス
Inventors: TSUDA Shotaro
津田 祥太郎
HIRAOKA Nobuyasu
平岡 伸康
OKITA Nobuaki
沖田 展彬
NISHIDA Takayuki
西田 崇之
Title: SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Abstract:
Provided is a technique for reducing the re-adhesion of foreign substances, which have been adhered to a cup, to a substrate. The substrate processing device 1 has an upper cup part 32 having: a first cylindrical section 321 and a second cylindrical section 322 which are formed in cylindrical shapes capable of surrounding a substrate W held in a substrate holding part 10, wherein the second cylindrical section 322 is connected to an upper portion of the first cylindrical section 321. In addition, the substrate processing device 1 is provided with a cup moving part 36 which moves the upper cup part 32 in the vertical direction and thereby stops the upper cup part 32 at a position at which the first cylindrical section 321 surrounds the substrate W and a position at which the second cylindrical section 322 surrounds the substrate W.