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1. (WO2018146821) PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST FILM USING SAID PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE PRINTED WIRING BOARD, AND IMAGE DISPLAY DEVICE
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Pub. No.: WO/2018/146821 International Application No.: PCT/JP2017/007954
Publication Date: 16.08.2018 International Filing Date: 28.02.2017
IPC:
G03F 7/004 (2006.01) ,G03F 7/027 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Applicants:
株式会社有沢製作所 ARISAWA MFG. CO., LTD. [JP/JP]; 新潟県上越市南本町1丁目5番5号 5-5, Minami-honcho 1-chome, Joetsu-shi, Niigata 9438610, JP
Inventors:
権平 貴志 GONDAIRA Takashi; JP
田井 誠 TAI Makoto; JP
Agent:
特許業務法人栄光特許事務所 EIKOH PATENT FIRM, P.C.; 東京都港区西新橋一丁目7番13号 虎ノ門イーストビルディング10階 Toranomon East Bldg. 10F, 7-13, Nishi-Shimbashi 1-chome, Minato-ku, Tokyo 1050003, JP
Priority Data:
2017-02062807.02.2017JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST FILM USING SAID PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE PRINTED WIRING BOARD, AND IMAGE DISPLAY DEVICE
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM D’ÉPARGNE DE SOUDAGE METTANT EN ŒUVRE CETTE COMPOSITION, CARTE DE CIRCUIT IMPRIMÉ SOUPLE, ET DISPOSITIF D’AFFICHAGE D’IMAGE
(JA) 感光性樹脂組成物、該感光性樹脂組成物を用いたソルダーレジストフィルム、フレキシブルプリント配線板及び画像表示装置
Abstract:
(EN) The present invention provides a photosensitive resin composition with which a dry resist film can be obtained, the dry resist film exhibiting excellent storage stability and migration resistance in thickness direction thereof. This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; and a thermosetting agent. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80℃ or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. (In formula (1), R1, R2, X1, X2, and n are as defined in the description.)
(FR) L’invention fournit une composition de résine photosensible qui permet d’obtenir un film d’épargne sec qui se révèle excellent en termes de résistance à la migration dans une direction épaisseur et de stabilité de conservation. La composition de résine photosensible de l’invention comprend un prépolymère photosensible possédant un groupe carboxyle ainsi qu’un groupe éthyléniquement insaturé, un initiateur de photopolymérisation, et un agent de durcissement thermique. Cet agent de durcissement thermique consiste en un composé polycarbodiimide représenté par la formule (1) et protégé par un groupe amino duquel un groupe carbodiimide se détache à température supérieure ou égale à 80°C. Le composé polycarbodiimide présente une masse moléculaire moyenne en poids comprise entre 300 et 3000, et un équivalent carbodiimide compris entre 150 et 600. (Dans la formule (1), R, R, X, X et n sont chacun tels que définis dans la description.)
(JA) 本発明は、厚さ方向の耐マイグレーション性と保存安定性に優れたドライレジストフィルムを得ることのできる感光性樹脂組成物を提供する。本発明の感光性樹脂組成物は、カルボキシル基及びエチレン性不飽和基を有する感光性プレポリマー、光重合開始剤及び熱硬化剤を含有し、熱硬化剤が、カルボジイミド基が80℃以上の温度で解離するアミノ基により保護された、式(1)で表されるポリカルボジイミド化合物であり、ポリカルボジイミド化合物は、重量平均分子量が300~3000であり、カルボジイミド当量が150~600である。  (式(1)中、R、R、X、X及びnはそれぞれ、明細書に記載された定義と同様である。)
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)