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1. (WO2018146816) ELECTRONIC DEVICE
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Pub. No.: WO/2018/146816 International Application No.: PCT/JP2017/005157
Publication Date: 16.08.2018 International Filing Date: 13.02.2017
Chapter 2 Demand Filed: 12.07.2017
IPC:
H01L 23/36 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
新電元工業株式会社 SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. [JP/JP]; 東京都千代田区大手町二丁目2番1号 2-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo 1000004, JP
Inventors:
湧口 純弥 YUGUCHI Junya; JP
池田 康亮 IKEDA Kousuke; JP
鈴木 健一 SUZUKI Kenichi; JP
Agent:
大野 聖二 OHNO, Seiji; JP
大野 浩之 OHNO, Hiroyuki; JP
Priority Data:
Title (EN) ELECTRONIC DEVICE
(FR) DISPOSITIF ÉLECTRONIQUE
(JA) 電子機器
Abstract:
(EN) An electronic device having: an electronic module having an insulating substrate 60, a conductor layer 20 provided on the insulating substrate 60, an electronic element 40 provided on the conductor layer 20, and a heat dissipating layer 10 provided on the opposite side of the insulating substrate 60 to the electronic element 40; and a cooling body 100 that comes in contact with the heat dissipating layer 10. The cooling body 100 has a segmented section 110 that is segmented into a plurality of regions and provided in a section that comes in contact with the heat dissipating layer 10.
(FR) L'invention concerne un dispositif électronique comprenant : un module électronique ayant un substrat isolant 60, une couche conductrice 20 disposée sur le substrat isolant 60, un élément électronique 40 disposé sur la couche conductrice 20, et une couche de dissipation de chaleur 10 disposée sur le côté opposé du substrat isolant 60 à l'élément électronique 40; et un corps de refroidissement 100 qui vient en contact avec la couche de dissipation de chaleur 10. Le corps de refroidissement 100 comprend une section segmentée 110 qui est segmentée en une pluralité de régions et disposée dans une section qui vient en contact avec la couche de dissipation de chaleur 10.
(JA) 電子機器は、絶縁性基板60と、前記絶縁性基板60に設けられた導体層20と、前記導体層20に設けられた電子素子40と、前記絶縁性基板の60前記電子素子40と反対側に設けられた放熱層10と、有する電子モジュールと、前記放熱層10と当接する冷却体100と、を有している。前記冷却体100は、前記放熱層10と当接する部分に設けられ、複数の領域に分割された分割部110を有している。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)