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|1. (WO2018146618) METHOD OF FINISHING A METALLIC CONDUCTIVE LAYER|
|Applicants:||NATIONAL RESEARCH COUNCIL OF CANADA
GROUPE GRAHAM INTERNATIONAL INC.
KELL, Arnold J.
MALENFANT, Patrick Roland Lucien
|Title:||METHOD OF FINISHING A METALLIC CONDUCTIVE LAYER|
A process for finishing a conductive metallic layer (e.g. a layer of copper metal) involves coating a molecular silver ink on the conductive metallic layer and decomposing the silver ink to form a solderable coating of silver metal on the conductive metallic layer. The molecular silver ink includes a silver carboxylate, a carrier and a polymeric binder. The process is additive and enables the cost-effective formation of a silver metal finish on conductive metallic layers, which both protects the conductive metallic layer from oxidation and further corrosion and allows soldering with lead and lead-free solders.