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1. (WO2018146618) METHOD OF FINISHING A METALLIC CONDUCTIVE LAYER

Pub. No.:    WO/2018/146618    International Application No.:    PCT/IB2018/050790
Publication Date: Fri Aug 17 01:59:59 CEST 2018 International Filing Date: Fri Feb 09 00:59:59 CET 2018
IPC: H05K 3/22
C09D 11/03
H05K 1/02
C09D 11/52
Applicants: NATIONAL RESEARCH COUNCIL OF CANADA
GROUPE GRAHAM INTERNATIONAL INC.
Inventors: LAFRENIÈRE, Sylvie
DEORE, Bhavana
PAQUET, Chantal
KELL, Arnold J.
MALENFANT, Patrick Roland Lucien
Title: METHOD OF FINISHING A METALLIC CONDUCTIVE LAYER
Abstract:
A process for finishing a conductive metallic layer (e.g. a layer of copper metal) involves coating a molecular silver ink on the conductive metallic layer and decomposing the silver ink to form a solderable coating of silver metal on the conductive metallic layer. The molecular silver ink includes a silver carboxylate, a carrier and a polymeric binder. The process is additive and enables the cost-effective formation of a silver metal finish on conductive metallic layers, which both protects the conductive metallic layer from oxidation and further corrosion and allows soldering with lead and lead-free solders.