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1. (WO2018145955) ELECTRICAL CONTACTING METHOD AND POWER MODULE
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Pub. No.: WO/2018/145955 International Application No.: PCT/EP2018/052292
Publication Date: 16.08.2018 International Filing Date: 30.01.2018
IPC:
H01L 21/60 (2006.01) ,H01L 23/488 (2006.01) ,H01L 23/467 (2006.01) ,H01L 23/473 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
46
involving the transfer of heat by flowing fluids
467
by flowing gases, e.g. air
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
46
involving the transfer of heat by flowing fluids
473
by flowing liquids
Applicants:
SIEMENS AKTIENGESELLSCHAFT [DE/DE]; Werner-von-Siemens-Straße 1 80333 München, DE
Inventors:
BAUEREGGER, Hubert; DE
DONAT, Albrecht; DE
KASPAR, Michael; DE
KRIEGEL, Kai; DE
MITIC, Gerhard; DE
SCHWARZ, Markus; DE
SCHWARZBAUER, Herbert; DE
STEGMEIER, Stefan; DE
WEIDNER, Karl; DE
ZAPF, Jörg; DE
Priority Data:
10 2017 001 248.209.02.2017DE
10 2017 201 979.408.02.2017DE
10 2017 211 619.607.07.2017DE
Title (EN) ELECTRICAL CONTACTING METHOD AND POWER MODULE
(FR) PROCÉDÉ DE MISE EN CONTACT ÉLECTRIQUE ET MODULE DE PUISSANCE
(DE) VERFAHREN ZUR ELEKTRISCHEN KONTAKTIERUNG UND LEISTUNGSMODUL
Abstract:
(EN) In a method for electrically contacting a component (10) (e.g. a substrate) with at least one electrical contact (30), an open-cell contact layer is additively formed on the at least one contact (30), in particular using a nozzle (55). The contact layer can be in tangled form (160), a folded weave (wire) (260) or foam crumbs (360) which are left behind after the evaporation of a carrier liquid (355) from a paste applied to the component (10), said paste comprising particles (of a mixture of granular material (360) in the form of foam crumbs (360) and the carrier liquid (355)). The contact layer can be then electrically contacted with the contact (30) by electroplating (especially electrochemically or without external current). A power module (50) can have a cooling channel in which a power component is provided together with the contact layer used to contact said component, and a cooling fluid, in particular a coolant liquid or coolant gas can flow through the cooling channel.
(FR) L'invention concerne un procédé de mise en contact électrique d'un composant avec au moins un contact électrique, selon lequel une couche de contact à pores ouverts est formée au niveau dudit au moins un contact par un procédé additif.
(DE) Bei einem Verfahren zur elektrischen Kontaktierung eines Bauteils (10) (z.B. eines Substrats) mit mindestens einem elektrischen Kontakt (30) wird an den zumindest einen Kontakt (30) eine offenporige Kontaktschicht additiv gebildet, insbesondere mittels einer Düse (55). Die Kontaktschicht kann als ein Knäuel (160), als ein gefaltetes Gewebe (Draht) (260) oder mit Schaumbröseln (360), die nach Verdampfung einer Trägerflüssigkeit (355) aus einer auf das Bauteil (10) aufgetragenen Paste mit Partikeln (eines Gemisches von einem Granulat (360) in der Form der Schaumbröseln (360) und der Trägerflüssigkeit (355)) verbleiben, gebildet werden. Die Kontaktschicht kann anschließend mittels Galvanisierens (insbesondere elektrochemisch oder außenstromfrei) an den Kontakt (30) elektrisch kontaktiert werden. Ein Leistungsmodul (50) kann einen Kühlkanal aufweisen, in dem ein Leistungsbauteil, das mit der Kontaktschicht kontaktiert wurde, gemeinsam mit dieser Kontaktschicht angeordnet ist, wobei der Kühlkanal mit Kühlfluid, insbesondere Kühlflüssigkeit oder Kühlgas, durchströmbar ist.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)