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1. (WO2018144959) MULTI-COLUMN SPACING FOR PHOTOMASK AND RETICLE INSPECTION AND WAFER PRINT CHECK VERIFICATION

Pub. No.:    WO/2018/144959    International Application No.:    PCT/US2018/016761
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Sun Feb 04 00:59:59 CET 2018
IPC: G03F 9/00
G03F 7/20
Applicants: KLA-TENCOR CORPORATION
Inventors: HAYNES, Robert
CHILESE, Frank
PREIL, Moshe
Title: MULTI-COLUMN SPACING FOR PHOTOMASK AND RETICLE INSPECTION AND WAFER PRINT CHECK VERIFICATION
Abstract:
A multi-column assembly for a scanning electron microscopy (SEM) system is disclosed. The multi-column assembly includes a plurality of electron-optical columns arranged in an array defined by one or more spacings. Each electron-optical column includes one or more electron-optical elements. The plurality of electron-optical columns is configured to characterize one or more field areas on a surface of a sample secured on a stage. The number of electron-optical columns in the plurality of electron-optical columns equals an integer number of inspection areas in a field area of the one or more field areas. The one or more spacings of the plurality of electron-optical columns correspond to one or more dimensions of the inspection areas.