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1. (WO2018144618) METHODS FOR FAST AND REVERSIBLE DRY ADHESION TUNING BETWEEN COMPOSITE STRUCTURES AND SUBSTRATES USING DYNAMICALLY TUNABLE STIFFNESS
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Pub. No.: WO/2018/144618 International Application No.: PCT/US2018/016269
Publication Date: 09.08.2018 International Filing Date: 31.01.2018
IPC:
H01L 21/78 (2006.01) ,H01L 21/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
78
with subsequent division of the substrate into plural individual devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
Applicants: BOARD OF REGENTS OF THE NEVADA SYSTEM OF HIGHER EDUCATION, ON BEHALF OF THE UNIV. OF NEVADA, RENO[US/US]; Office of Enterprise and Innovation 1664 N. Virginia Street, Mail Stop 321 Reno, NV 89557, US
THE TRUSTEES OF THE UNIVERSITY OF PENNSYLVANIA[US/US]; 3160 Chesnut Street, Suite 200 Philadelphia, PA 19104, US
Inventors: SHAN, Wanliang; US
TURNER, Kevin; US
Agent: SCHWARTZ, Johanna; US
Priority Data:
62/453,20701.02.2017US
Title (EN) METHODS FOR FAST AND REVERSIBLE DRY ADHESION TUNING BETWEEN COMPOSITE STRUCTURES AND SUBSTRATES USING DYNAMICALLY TUNABLE STIFFNESS
(FR) PROCÉDÉS DE RÉGLAGE DE L'ADHÉRENCE SÈCHE, RAPIDE ET RÉVERSIBLE ENTRE DES STRUCTURES COMPOSITES ET DES SUBSTRATS À L'AIDE D'UNE RIGIDITÉ RÉGLABLE DE MANIÈRE DYNAMIQUE
Abstract:
(EN) Disclosed herein are embodiments of methods that utilize dry adhesion tuning of a composite structure to adhere substrates. In some embodiments, the disclosed methods utilize dry adhesion between a composite structure and a substrate and further dynamically control the resulting dry adhesion strength through a heating step, which facilitates rigidity tuning of a core component of the composite structure and/or facilitates thermal control of the interface between the substrate and the composite structure. Also disclosed herein are array devices and other products comprising the disclosed composite structures.
(FR) Selon certains modes de réalisation, l'invention concerne des procédés qui utilisent un réglage de l'adhérence sèche d'une structure composite dans le but de la faire adhérer à des substrats. Selon certains modes de réalisation, les procédés décrits utilisent une adhérence sèche entre une structure composite et un substrat et régulent en outre de façon dynamique la force d'adhérence sèche résultante par l'intermédiaire d'une étape de chauffage, ce qui facilite le réglage de rigidité d'un composant de noyau de la structure composite et/ou facilite la régulation thermique de l'interface entre le substrat et la structure composite. L'invention concerne également des dispositifs de réseau et d'autres produits comprenant les structures composites décrites.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)