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1. (WO2018144452) APPLYING EQUALIZED PLASMA COUPLING DESIGN FOR MURA FREE SUSCEPTOR

Pub. No.:    WO/2018/144452    International Application No.:    PCT/US2018/015945
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Wed Jan 31 00:59:59 CET 2018
IPC: C23C 16/458
C23C 16/505
Applicants: APPLIED MATERIALS, INC.
Inventors: PARK, Beom Soo
LEE, Dongsuh
YANG, Hsiao-Lin
CHANG, Fu-Ting
AN, Hsiang
SU, Tsung-Yao
Title: APPLYING EQUALIZED PLASMA COUPLING DESIGN FOR MURA FREE SUSCEPTOR
Abstract:
A method and apparatus for equalized plasma coupling is provided herein. Discontinuity marks, also known as golf tee mura, are eliminated or minimized by biasing or grounding lift pins disposed in openings towards the center of a substrate support. To prevent shorting between a biased or grounded lift pin and the substrate support, lift pins are electrically isolated from the substrate support. The electrical isolation of the lift pin includes coating the lift pins with an electrically insulating material or lining a respective substrate support opening with an electrically insulating material.