Search International and National Patent Collections

1. (WO2018144199) GLASS WAVEGUIDE ASSEMBLIES FOR OE-PCBs AND METHODS OF FORMING OE-PCBs

Pub. No.:    WO/2018/144199    International Application No.:    PCT/US2018/013108
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Thu Jan 11 00:59:59 CET 2018
IPC: G02B 6/122
G02B 6/42
H05K 1/02
G02B 6/12
G02B 6/43
Applicants: CORNING OPTICAL COMMUNICATIONS LLC
Inventors: BRUSBERG, Lars Martin Otfried
Title: GLASS WAVEGUIDE ASSEMBLIES FOR OE-PCBs AND METHODS OF FORMING OE-PCBs
Abstract:
The glass waveguide assembly includes a substrate with glass optical waveguides formed in the body of the glass substrate without adding or removing any glass from the substrate body. The glass optical waveguides run generally from a front-end section to a back-end section. A protective coating is formed over at least a portion of the top surface of the glass substrate where the glass optical waveguides reside. Optical connectors are formed at or adjacent the back end at corresponding connector regions. Each connector includes an end portion of at least one of the glass optical waveguides. In some configurations, the glass waveguide assembly includes a bend section that facilitates forming an optical interconnection in a photonic system between an optical-electrical printed circuit board and photonic integrated circuit.